Thermoelectric Properties of Bi0.5Sb1.5Te3 Prepared by the Ultrarapid Quenching Process

Abstract:

Article Preview

P-type Bi0.5Sb1.5Te3 thermoelectric materials have been prepared by ultrarapid quenching method with various cooling rates. The microstructures of sample are very different from those prepared by normal cooling. The ultrarapid quenched material was obtained in the shape of foils, the thickness of which were found to vary in the range of 6-20 μm, which corresponds to a cooling rate of about 106 K/S. X-ray diffraction evidenced a microcrystalline structure of the expected composition with a (0015) plane. Increasing the cooling rate, the Seebeck coefficient increase, the electrical conductivity decrease and the power factor rise up to 4.4×10-3 Wm-1K-2 .The highest ZT value of 1.22 was achivedachieved for the materials with the copper roller roration speed 40 m/s in room temperarure.

Info:

Periodical:

Materials Science Forum (Volumes 610-613)

Main Theme:

Edited by:

Zhong Wei Gu, Yafang Han, Fu Sheng Pan, Xitao Wang, Duan Weng and Shaoxiong Zhou

Pages:

394-398

DOI:

10.4028/www.scientific.net/MSF.610-613.394

Citation:

S. H. Wei et al., "Thermoelectric Properties of Bi0.5Sb1.5Te3 Prepared by the Ultrarapid Quenching Process", Materials Science Forum, Vols. 610-613, pp. 394-398, 2009

Online since:

January 2009

Export:

Price:

$35.00

In order to see related information, you need to Login.