Action of Displacement Control on Vacuum Free Aluminum/Copper Diffusion Liquefaction Bonding

Hiroshi Kawakami; Toshiharu Kawabe; Jippei Suzuki

doi:10.4028/www.scientific.net/MSF.638-642.3297

Paper Titles

Microstructure and Texture Evolution in a High Manganes Austenitic Steel During Tensile Test
p.3272

Static Strain Ageing in Some Austenitic Stainless Steels
p.3278

Study of the Columnar Grain Growth in IF Steels during Continuous Heat Cycles
p.3284

A Technical and Economic Analysis of Pig Iron Production
p.3291

Action of Displacement Control on Vacuum Free Aluminum/Copper Diffusion Liquefaction Bonding
p.3297

Bending Property of Liner Laser Irradiated Thin High Carbon Steel
p.3302

Effect of Martensite in Initial Structure on Bainite Transformation
p.3307

Effects of Manganese Content and Heat Treatment Condition on Mechanical Properties and Microstructures of Fine-Grained Low Carbon TRIP-Aided Steels
p.3313

First-Principles Calculations and the Thermodynamics of Cementite
p.3319

HomeMaterials Science ForumMaterials Science Forum Vols. 638-642Action of Displacement Control on Vacuum Free...

Action of Displacement Control on Vacuum Free Aluminum/Copper Diffusion Liquefaction Bonding

Abstract:

Quickness of fracture of Al oxide film is important especially for vacuum free Al/Cu bonding. Displacement amount and rate relate closely with fracture of oxide film and create clean surface. Displacement history during bonding process under static bonding load was measured for displacement control systematically. Displacement history under static load consists of three stages with creep and liquefaction. Higher bonding load increased displacement rate of each stage and decreased the thickness of Al oxide film grown by air heating. Suitable hearing time for bond also was shortened by increment of bonding load. Two types of displacement control were designed from these experimental results. One was the accelerated displacement rate control, another was the cyclic displacement control. Fracture of Al oxide film and liquefaction of bonding surface occurred at lower displacement than static load by each displacement control.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Materials Science Forum (Volumes 638-642)

Pages:

3297-3301

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.638-642.3297

Citation:

Cite this paper

Online since:

January 2010

Authors:

Hiroshi Kawakami, Toshiharu Kawabe, Jippei Suzuki

Keywords:

Aluminum (Al), Copper (Cu), Diffusion, Displacement Control, Liquefaction, Vacuum Free Dissimilar Bonding

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] D. Hauser, P.A. Kammer and J.H. Dedrick: Welding Research Supplement , 11s(1966).

Google Scholar

[2] O. Ohashi and K. Sasabe: Transactions of National Research Institute for Metals Vol. 33, No. 1, 42(1991).

Google Scholar

[3] A.A. Shirzadi and E.R. Wallach: Science and Technology of Welding and Joining, Vol. 2, No. 3, 89(1997).

Google Scholar

[4] Y. Natsume, K. Ohsasa, Y. Tayu, T. Momono, T. Narita: ISIJ International Vol. 43, No. 12, 1976(2003).

DOI: 10.2355/isijinternational.43.1976

Google Scholar

[5] H. Kawakami, J. Suzuki and J. Nakajima: Welding International, Vol. 21, No. 12, 836(2007).

Google Scholar

[6] H. Kawakami, K. Kimura, S. Kondo and J. Suzuki: Key Engineering Materials, Vol. 345-346, 1457(2007).

Google Scholar

[7] H. Kawakami, J. Nakajima and J. Suzuki: Proceedings of The 10 th International Conference on Joints in Aluminum, 101(2007).

Google Scholar