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Mechanism of Whisker Growth Suppression by Lead Co-Deposition on Electroplated Tin Film

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Abstract:

This study investigated the effect of lead on the whisker growth of a tin film that was the electrodeposited on a phosphor bronze substrate. Subsequent FE-AES observation revealed that the whisker growth on the electrodeposited tin film varied depending on the morphology of the oxide film. The whisker growth was suppressed concomitantly with thinness or fragility of the oxide film formed on the tin deposits. The whisker growth was also suppressed concomitantly with the lead co-deposition in the tin deposits. In the Sn/Sn-Pb multilayer, because the lead between the tin film and the substrate was transferred to the surface, the whisker growth was also suppressed. This whisker growth suppression effect caused by the existence of a lead in the tin deposits was attributed to the oxide film thinning and embrittlement, depending on the lead transfer to the surface at room temperature.

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Info:

Periodical:

Materials Science Forum (Volumes 638-642)

Pages:

835-840

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.638-642.835

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Online since:

January 2010

Authors:

Makoto Hino, Koji Murakami, Yutaka Mitooka, Masao Takamizawa, Toshihide Naka, Kiyomichi Nakai

Keywords:

Analysis, Lead Transfer, Surface, Tin Electroplating, TiN Whisker

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© 2010 Trans Tech Publications Ltd. All Rights Reserved

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