The Bonding Structure of the Various High Purity or Binderless Polycrystalline Cubic Boron Nitride Compacts Sintered at 5 to 7GPa and 1600 to 2000 °C

Eko Akhmadi; Akaishi Minoru; Tajima Itsuro

doi:10.4028/www.scientific.net/MSF.654-656.2390

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HomeMaterials Science ForumMaterials Science Forum Vols. 654-656The Bonding Structure of the Various High Purity...

The Bonding Structure of the Various High Purity or Binderless Polycrystalline Cubic Boron Nitride Compacts Sintered at 5 to 7GPa and 1600 to 2000 °C

Abstract:

The cBN-cBN direct bonding structure of some cBN compacts made by the method of the direct conversion of the pyrolytic-BN (pBN) or wurtzite-BN (wBN) to cubic-BN at the pressure of 7GPa and temperature 2000 °C and the cBN compact made by the method of sintering the cBN powder along with polyvinylidene chloride (PVDC) at the condition of 5.5GPa and 1600 °C has been studied. The XRD, SEM, TEM analysis and the wear resistance on the ductile cast iron machining has been investigated. While the XRD analysis of the above cBN samples showed that all samples consist only of cBN, and the SEM observation showed that they all have the cBN-cBN direct bonding structure, A STEM analysis showed the existence of the impurities at the cBN crystal boundary. The starting materials and the sintering method affect the degree of these impurities.

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Periodical:

Materials Science Forum (Volumes 654-656)

Pages:

2390-2393

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.654-656.2390

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Online since:

June 2010

Authors:

Eko Akhmadi, Akaishi Minoru, Tajima Itsuro

Keywords:

Cubic Boron Nitride (CBN), Cutting Tool, High-Pressure, High-Temperature

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References

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