Ultrafine Structure Formation in Aluminium Alloy Processed by HPT and the Mechanical Properties Response
In this study ultrafine grain structure evolution during high pressure torsion (HPT) of commercial aluminium alloy AA6082 at increased temperature is presented. Two different initial structural states of the alloy were prepared by thermal treatment. The progress in structure refinement in dependence on the shear strain level strain was investigated by TEM of thin foils. The impact of different amount of strain (εef) introduced was analyzed with respect to the effect of increased temperature. The microhardness results measured across the deformed discs pointed out that some data scattering. The results of microstructure analyses showed that ultrafine grain (ufg) structure was already formed in deformed disc upon the first turn, regardless the initial structure of alloy, resulting from prior thermal treatment. The observed heterogeneity in ufg structure formation across the deformed disc was observed, supporting microhardness results scattering. By increasing the strain level (number of turns N -2,4,6), more effectively homogenized ufg structure was observed across the deformed discs. The effect of increased deformation temperature became evident and dynamic recrystalization modified locally ufg structure. The retardation of new grains growth and higher thermal stability of ufg structure was observed, when two steps thermal treatment of alloy (quenching and ageing) was executed prior deformation. Strength measurements results yielded from tensile tests showed that the effect of structure strengthening was degraded by local recrystallization. The results of torque measurement versus the time showed that the torque required to deform the sample was increasing until the first turn and then kept stable or even decreased.
Jing Tao Wang, Roberto B. Figueiredo and Terence G. Langdon
J. Zrník et al., "Ultrafine Structure Formation in Aluminium Alloy Processed by HPT and the Mechanical Properties Response", Materials Science Forum, Vols. 667-669, pp. 903-908, 2011