Microstructure and Wear-Resistant SiC Film by RF Magnetron Sputtering

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A wear-resistant SiC (silicon carbon) film on titanium substrate was prepared by magnetron sputtering technology. The film exhibits low nano-hardness of 12.1 GPa and low Young's modulus of 166.2 GPa together with superior friction/wear properties. As sliding against Si3N4 (silicon nitride) ball (2 mm in radius) at room temperature under Kokubo simulation body fluid condition, the film exhibited the friction coefficient of about 0.215 and the special wear rate in the order of magnitude of 10−5 mm3/ Nm even at the load of 500g without film cracking and interface delaminating. The high film-cracking and interface-delaminating resistance is due to the low hardness of the film and the good film/substrate modulus match caused by the low elastic modulus of the film.

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580-584

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June 2011

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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[1] P. Aspenberg, A. Anttila, Y.T. Konttinen, R. Lappalainen, S.B. Goodman, L. Nordsletten and S. Santavirtall: Biomaterials Vol. 17(8) (1996), p.807.

DOI: 10.1016/0142-9612(96)81418-9

Google Scholar

[2] J. Esteve, A. Lousa, E. Martinez, H. Huck, E.B. Halac, M. Reinoso: Diamond Relat. Mater. Vol. 10(3-7) (2001), p.1053.

Google Scholar

[3] T. Kokubo, H. Kushitani, S. Sakka, T. Kitsugi, T. Yamamuro: J. Biomed. Mater. Res. Vol. 24(6) (1990), p.721.

DOI: 10.1002/jbm.820240607

Google Scholar

[4] N. Fujisawa, R.M. David, L.J. Natalie, C.W. John, V. S. Michael: Wear Vol. 260(1-2) (2006), p.62.

Google Scholar

[5] A. Leyland, A. Matthews: Wear Vol. 246(1-2) (2000), p.1.

Google Scholar

[6] K.H. Lee, O. Takai: Diamond Relat. Mater. Vol. 14(9) (2005), p.1444.

Google Scholar

[7] W. Österle, D. Klaffke, M. Griepentrog, U. Gross, I. Kranz, C.W. Knabe: Wear Vol. 264(7-8) (2008), p.505.

DOI: 10.1016/j.wear.2007.04.001

Google Scholar