Effect of Trench Aspect Ratio on Microstructure and Texture in Damascene Cu Interconnects

Abstract:

The effect of trench aspect ratio and line spacing on microstructure and texture in annealed damascene Cu interconnects has been investigated. The X-ray diffraction (XRD) and electron backscatter diffraction (EBSD) analyses of Cu lines, showed a preferred {111} orientation and the trenches reduce the proportion of high-angle grain boundaries and increase the fraction of coincidence site lattice (CSL) grain boundaries, comparing with the Cu blanket film. In addition, both trench aspect ratio and line spacing can largely affect the microstructure and texture in annealed damascene Cu interconnects.

• Periodical: Materials Science Forum (Volumes 706-709)
• Pages: 2605-2610
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.706-709.2605
• Online since: January 2012
• Authors: L. Chen, G.J. Yuan, J.G. Xu, F. Guo, N. Pang
• Keywords: Cu Interconnects, Microstructure, Texture, Trench Aspect Ratio

References

[1] J. Kriz, C. Angelkort, M. Czekalla, S. Huth, D. Meinhold, A. Pohl, S. Schulte, A. Thamm, S. Wallace: Microelectron. Eng. Vol. 85 (2008), p.2128.

DOI: 10.1016/j.mee.2008.05.034

[2] C.M. Tan, A. Roy: Mater. Sci. Eng. R Vol. 58 (2007), p.1.

[3] L. Arnaud, G. Tartavel, T. Berger, D. Mariolle, Y. Gobil, I. Touet: Microelectron. Reliab. Vol. 40 (2000), p.77.

DOI: 10.1016/s0026-2714(99)00209-7

[4] E. Zschech, V. Sukharev: Microelectron. Eng. Vol. 82 (2005), p.629.

[5] D. Kwon, H. Park, C. Lee: Thin Solid Films Vol. 475 (2005), p.58.

[6] H. Lee, S.D. Lopatin: Thin Solid Films Vol. 492 (2005), p.279.

[7] J.Y. Cho, H.J. Lee, H. Kim, J.A. Szpunar: J. Electron. Mater. Vol. 34 (2005), p.506.

[8] K.J. Ganesh, S. Rajasekhara, J.P. Zhou, P.J. Ferreira: Scripta Mater. Vol. 62 (2010), p.843.

[9] C. Lingk, M.E. Gross, W.L. Brown: Appl. Phys. Lett. Vol. 74 (1999), p.682.

[10] K. Mirpuri, J. Szpunar, K. Kozacaek, in: Characterization and Metrology for ULSI Technology: 2003 International Conference, edtied by D.G. Seiler, A.C. Diebold, T.J. Shaffner, R. MacDonald, S. Zollner, R.P. Khosla, E.M. Secula, American Institute of Physics (2003).

[11] K. Mirpuri, J. Szpunar: Mater. Charact. Vol. 54 (2005), p.107.

[12] D.P. Field, D. Dornisch, H.H. Tong: Scripta Mater. Vol. 45 (2001), p.1069.

[13] K. Mirpuri, J. Szpunar: Micron Vol. 35 (2004), p.575.

[14] H.J. Lee, D.I. Kim, J.H. Ahn, D.N. Lee: Thin Solid Films Vol. 474 (2005), p.250.

[15] H.J. Bunge: Texture Analysis in Material Science (Butterworths, London, 1982).

[16] S.P. Riege, C.V. Thompson: Scripta Mater. Vol. 41 (1999), p.403.

[17] C.V. Thompson, R. Care: J. Mech. Phys. Solids Vol. 44 (1996), p.657.

[18] L. Vanasupa, Y.C. Change, R.P. Besser, S. Pramanick: J. Appl. Phys. Vol. 85 (1999), p.2583.

[19] Y. Ji, T.X. Zhong, Z.G. Li, X.D. Wang, D. Luo, Y. Xia, Z.M. Liu: Microelectron. Eng. Vol. 71 (2004), p.182.

[20] K.T. Lee, J.A. Szpunar, D.B. Knorr: Mater. Sci. Forum Vol. 204-206 (1996), p.423.