Observation of Stress-Driven Migration of Specific Planar Grain Boundaries in Al Bicrystals

Abstract:

Stress induced grain boundary migration was experimentally investigated in aluminum bicrystals. Migration of planar symmetrical <100> and <111> tilt boundaries under a shear stress was observed to be accompanied by a lateral translation of the adjacent grains. This coupling proved to be the typical migration mode for all investigated boundaries, no matter whether low-or high angle, low Σ CSL coincidence or non-coincidence boundary. The migration-shear coupling was also observed for asymmetrical tilt boundaries. Measurements of the temperature dependence of coupled boundary migration revealed that there is a specific misorientation dependence of the migration activation parameters. Contrary to expectations, a high angle Σ7 tilt boundary moved under an applied stress, but produced practically no shear during its migration.

• Periodical: Materials Science Forum (Volumes 706-709)
• Pages: 2886-2891
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.706-709.2886
• Online since: January 2012
• Authors: Dmitri A. Molodov, Tatiana Gorkaya, Günter Gottstein
• Keywords: Bi-Crystal, Dislocation, Grain Boundary Migration, Shear Stress

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