On the Effects of Mechanical and Thermal Treatment Strategies Regarding the Grain Boundary Structure of Polycrystalline Copper

Abstract:

Commercial Cu-ETP drawn copper bar was both mechanically and thermally treated. Repeated cycles of cold rolling and heat treatment with altered parameters were applied on the specimens. Grain boundary character distribution (GBCD) was calculated from the orientation microscopy data. As regards the processing of the orientation data the coincidence site lattice theory was applied. The evolution of the GBCD is discussed in terms of the parameters of cold rolling and heat treatment processes.

• Periodical: Materials Science Forum (Volume 729)
• Pages: 503-508
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.729.503
• Online since: November 2012
• Authors: P. Varga, Péter János Szabó
• Keywords: Cold Rolling, Copper, CSL Grain Boundaries, EBSD, GBCD, Recrystallization

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