Influence of Cu Diffusion on Electrical Transport Properties of Bi_0.5Sb_1.5Te₃

Abstract:

Bi_0.5Sb_1.5Te₃ nanoplates from gas induced reduction (GIR) strategy were hot-pressed into bulk materials for thermoelectric properties investigation. During the electrical conductivity and Seebeck coefficient measurements, we found that the Cu from Cu electrodes diffused into samples when the measurement temperature was above 600 K. The phase composition and fracture surface of the samples before and after Cu diffusion were examined by X-ray diffraction (XRD), scanning electron microscope (SEM) and energy dispersive X-ray spectroscopy (EDS). We found that the Cu diffusion resulted in the composition deviation and formation of impurity phase, Cu_1.8Te. When the electrical conductivity and Seebeck coefficient of the samples were measured again but below 600 K, the samples showed different electrical transport behavior and had enhanced power factors.

• Periodical: Materials Science Forum (Volumes 743-744)
• Pages: 70-75
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.743-744.70
• Online since: January 2013
• Authors: Song Chen, Xin Wang, Zhi Gang Zou, Ke Feng Cai
• Keywords: Bi_0.5Sb_1.5Te₃, Cu Diffusion, Electrical Transport Properties, Nanostructure

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