Preparation of Tungsten-Copper Composite Powder by Electroless Plating

Ying Wang; Jun Tao Zou; Qing He Zhang

doi:10.4028/www.scientific.net/MSF.749.28

Paper Titles

Preface and Organizers

Effect of Strontium and T6 Heat Treatment on Structure and Performance of Al-11.6Si-0.5Mg Alloy
p.1

Microstructure and Precipitates of High-Pure Ferritic Stainless Steels Stabilized by Niobium and Titanium
p.7

Experimental and Numerical Study on Dieless Bending of 2-Piece Parallel Flow Microchannel Heat Exchanger
p.13

Preparation of Tungsten-Copper Composite Powder by Electroless Plating
p.28

Effect of Coil Temperature on Microstructure and Texture Evolution of an High Strength Nb-IF Steel Sheet
p.35

Analysis of Density and Mechanical Properties of Iron Powder with Upper Relaxation Assist through High Velocity Compaction
p.41

Effect of Addition Zr on As-Homogenization Microstructures of 5182 Aluminum Alloy
p.47

Research on Characteristics of Heat Treatment of Squeeze Cast Al-Cu-Mg Alloy
p.54

HomeMaterials Science ForumMaterials Science Forum Vol. 749Preparation of Tungsten-Copper Composite Powder by...

Preparation of Tungsten-Copper Composite Powder by Electroless Plating

Abstract:

In this paper, tungsten-copper composite powder was prepared on the particle size of 6 ~ 10μm tungsten powder surface by electroless copper plating. The orthogonal experimental results show that the primary and secondary order of factors affecting the deposition rate followwing the sequence: copper sulfate solution concentration > pH value> solution temperature> formaldehyde concentration > complexing agent concentration. The process of the electroless copper plating on the tungsten powder surface was investigated, and the best electroless copper plating solution composition and operation conditions were obtained as follows: plating temperature 323 K, stirring speed 30 r/min, PH =13, loadage 8g/L, CuSO4 5H₂O 0.032 mol/L, HCHO 0.274 mol/L, TEA 0.1208 mol/L, 2, 2 'league pyridine 12 mg/L.

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Periodical:

Materials Science Forum (Volume 749)

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28-34

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https://doi.org/10.4028/www.scientific.net/MSF.749.28

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Online since:

March 2013

Authors:

Ying Wang, Jun Tao Zou, Qing He Zhang

Keywords:

Deposition Rate, Electroless Copper Plating, Orthogonal Experimental, Tungsten-Copper Composite Powder

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