Effects of Machining Fluid on Electric Discharge Machining of SiC Ingot

Norimasa Yamamoto; Satarou Yamaguchi; Tomohisa Kato

doi:10.4028/www.scientific.net/MSF.778-780.767

Paper Titles

Thinning of a Two-Inch Silicon Carbide Wafer by Plasma Chemical Vaporization Machining Using a Slit Electrode
p.750

A Novel Grinding Technique for 4H-SiC Single-Crystal Wafers Using Tribo-Catalytic Abrasives
p.754

Dicing of SiC Wafer by Atmospheric-Pressure Plasma Etching Process with Slit Mask for Plasma Confinement
p.759

Multi-Wire Electrical Discharge Slicing for Silicon Carbide Part 2: Improvement on Manufacturing Wafers by Forty-Wire EDS
p.763

Effects of Machining Fluid on Electric Discharge Machining of SiC Ingot
p.767

High-Speed Slicing of SiC Ingot by High-Speed Multi Wire Saw
p.771

Development of Multi-Wire Electric Discharge Machining for SiC Wafer Processing
p.776

Fabrication of Electrostatically Actuated 4H-SiC Microcantilever Resonators by Using n/p/n Epitaxial Structures and Doping-Selective Electrochemical Etching
p.780

Characteristics of a Schottky Barrier Diode and the SiC Wafers Sliced by Wire Electrical Discharge Machining
p.784

HomeMaterials Science ForumMaterials Science Forum Vols. 778-780Effects of Machining Fluid on Electric Discharge...

Effects of Machining Fluid on Electric Discharge Machining of SiC Ingot

Abstract:

Recently, ingots of silicon carbide have been adapted to be sliced by the wire-cut electrical discharge machining. Fast slicing, and the reduction in the loss are important for slicing of the wafer. In this paper, characteristic features of the electric discharge machining in the ion-exchange water and the fluorine-based fluid were compared for these improvement. The discharge was caused by a pulse voltage applied to a ingot of silicon carbide and the wire in machining fluid, and the slicing was proceeded. As a result, improvement of surface roughness and kerf loss was confirmed, for the first time. In addition, the improving methods for fast slicing were considered.