Electro-Less Ni-P Plating Coating of In Situ TiCp/Al-4.5wt.%Cu Vomposites

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Abstract:

In situ TiCp/Al-4.5wt.%Cu composites have been coated using an electro-less Ni-P plating technique. The morphology and composition of the plating coating have been examined by scanning electron microscopy, optical microscopy, and X-ray diffraction. The results indicated that the coating had a high-phosphorus amorphous microstructure. The coatings microstructures showed significantly changes when the citric acid concentration in the chemical bath was varied in the range 16-20g/L.

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593-598

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April 2015

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© 2015 Trans Tech Publications Ltd. All Rights Reserved

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