Synthesis of Copper/Silicon-Carbide Composites in a Thermodynamic Disequilibrium

Abstract:

Composites with interpenetrating metal-ceramic microstructures (IPC, interpenetrating composites) can be tailored for specific applications, such as high thermal conductivity combined with low thermal expansion, e.g. for heat sinks. Heat sinks are required in power electronic devices or in future fusion reactor technology where extreme conditions and high cyclic thermo-mechanical loads appear. Due to its rigid ceramic backbone IPCs are expected to reveal high thermal stability. Pure silicon carbide exhibits high thermal conductivity, low coefficient of thermal expansion, high corrosion and wear resistance. But it is also known as a very brittle material when mechanical loads are applied. Thus a composite of silicon carbide with ductile and highly conductive copper seems to be a promising new material for a number of applications.This paper reports the synthesis of Cu-SiC composites using a unique high temperature squeeze casting process (HTSC). Microstructural design of SiC-preforms with open porosity and its synthesis progress is reported. Influence of preform properties, temperature, pressure and atmosphere during HTSC were investigated. A qualitative and quantitative description of the microstructure of the composites and their composition allows the creation of structure-property correlations that take effect retroactively to the casting process.

• Periodical: Materials Science Forum (Volumes 825-826)
• Pages: 189-196
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.825-826.189
• Online since: July 2015
• Authors: Maren Klement*, Alwin Nagel, Oliver Lott
• Keywords: Heat Sinks, Interpenetrating Composites, Open Porous SiC Preforms, Squeeze Casting

References

[1] R.D. Joseph, Copper and copper alloys, ASM international handbook, ASM, (2001).

[2] A. Luedtke, Thermal management materials for high-performance applications, Advanced Engineering Materials 6/3 (2004) 132-144.

[3] G. Celebi Efe, M. Ipek, S. Zeytin and C. Bindal, An investigation of the effect of SiC particles on Cu-SiC composites, Composites: Part B 43 (2012) 1813-1822.

DOI: 10.1016/j.compositesb.2012.01.006

[4] G.Q. Chen, Z.Y. Xiu, S.H. Meng, G.H. Wu and D.Z. Zhu, Thermal expansion and mechanical properties of high reinforcement content SiCp/Cu composites fabricated by squeeze casting technology, Trans. Nonferrous Metals Society China 19 (2009) 600-604.

DOI: 10.1016/s1003-6326(10)60116-1

[5] X.L. Shi, M. Wang, S. Zhang and Q. Zhang, Fabrication and properties of W-20Cu alloy reinforced by titanium nitride coated SiC fibers, Int. Journal of Refractory Metals and Hard Materials 41 (2013) 60-65.

DOI: 10.1016/j.ijrmhm.2013.02.002

[6] X.N. Zhang, I. Geng and B. Xu, Compressive behaviour of Al-based hybrid composites reinforced with SiC whisker and SiC nanoparticles, Materials Chemistry and Physics 101 (2007) 242-246.

DOI: 10.1016/j.matchemphys.2006.04.004

[7] T. Schubert, B. Trindade, T. Weißgärber and B. Kieback, Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications, Materials Science and Engineering A 475 (2008) 39-44.

DOI: 10.1016/j.msea.2006.12.146

[8] V. Pfaffenholz, S. Lindig, A. Brendel and H. Bolt, Synthesis and analysis of the thermal behavior of SiC-fibre reinforced copper matrix composites as heat sink material, Advanced Materials Research 59 (2009) 153-157.

DOI: 10.4028/www.scientific.net/amr.59.153

[9] P. Pertes, J. Hemptenmacher and H. Schurmann, Production of MMCs on the basis of fibres coated with the metal alloy by magnetron sputtering, Materials Science Forum (2007) 539-543.

DOI: 10.4028/www.scientific.net/msf.539-543.931

[10] C. Rado, B. Drevent and N. Eustathopoulos, The role of compound formation in reactive wetting: the Cu/SiC system, Acta Materialia 48 (2000) 4483-4491.

DOI: 10.1016/s1359-6454(00)00235-4

[11] X.H. Qu, L. Zhang, M. Wu and S. Ren, Review of metal composites with high thermal conductivity for thermal management applications, Progress in Natural Science: Materials International 21 (2011) 189-197.

DOI: 10.1016/s1002-0071(12)60029-x

[12] T. Köck, A. Brendel and H. Bolt, Interface reactions between silicon carbide and interlayers in silicon carbide-copper metal-matrix composites, Journal of Nuclear Materials 363 (2007) 197-201.

DOI: 10.1016/j.jnucmat.2007.01.022

[13] V. Martínez, S. Ordoñez, F. Castro, L. Olivares and J. Marín, Wettting of silicon carbide by copper alloys, Journal of Materials Science 38 (2003) 4047-4054.

DOI: 10.1023/a:1026270819828

[14] L. Zhang, X. Qu, B. Duan, X. He, M. Qin and X. Lu, Preparation of SiCp/Cu composite by Ti-activated pressureless infiltration, Trans. Nonferrous Metals Society China 18 (2008) 872-878.

DOI: 10.1016/s1003-6326(08)60151-x

[15] L. Zhang, X. Qu, B. Duan, X. He, S. Ren and M. Qin, Microstructure and thermos-mechanical properties of pressureless infiltrated SiCp/Cu composites, Composites Science and Technology 68 (2008) 2731-2738.

DOI: 10.1016/j.compscitech.2008.05.018

[16] J. Narciso, L. Weber, J.M. Molina, A. Mortensen and E. Louis, Reactivity and thermal behaviour of Cu-Si/SiC composites: effects of SiC oxidation, Materials Science and Technology 68 (2006) 1464-1468.

DOI: 10.1179/174328406x131000

[17] G.W. Liu, M.L. Muolo, F. Valenza and a. Passerone, Survey on wetting of SiC by molten metals, Ceramics International 36 (2010) 1177-1188.

DOI: 10.1016/j.ceramint.2010.01.001

[18] G. Sundberg, P. Paul, C. Sung and T. Vasilos, Fabrication of CuSiC metal matrix composites, Journal of Material Science 41 (2006) 485-504.

DOI: 10.1007/s10853-005-2622-3

[19] H. Xing, X. Cao, W. Hu, L. Zhao and J. Zhang, Interfacial reactions in 3D-SiC network reinforced Cu-matrix composites prepared by squeeze casting, Materials Letters 59 (2005) 1563-1566.

DOI: 10.1016/j.matlet.2005.01.023

[20] A. Ureña, E.E. Martı́nez, P. Rodrigo and L. Gil, Oxidation treatments for SiC particles used as reinforcement in aluminium matrix composites, Composites Science and Technology 64 (2004) 1843-1853.

DOI: 10.1016/j.compscitech.2004.01.010

[21] O. Lott, Interface Design of Copper/Alumina Composites with Interpenetrating Phase Structure, PhD thesis, School of Materials Science and Engineering University of New South Wales, Sydney, Australia, (2012).

[22] E.L. Garcia-Cordovilla, and J. Narciso, Pressure infiltration of packed ceramic particulates by liquid metals, Acta Materialia 47 (1999) 4461-79.

DOI: 10.1016/s1359-6454(99)00318-3