Thermal Conductivity Behaviour of Al/Diamond and Ag/Diamond Composites in the Temperature Range 4 K < T < 293 K

Abstract:

Two different systems, the non-reactive Ag–diamond and the reactive Al–diamond system, were assessed by their thermal conductivity behaviour, both were fabricated by gas pressure assisted infiltration of densely packed diamond bulks with aluminium or silver and different Si-concentration and diamonds of varying particle sizes. The effect of Si-concentration on the interface thermal conductance h between Al, Ag and diamonds was investigated in dependence of temperature by measuring thermal conductivity of composites with different sized diamond particles in the temperature range from 4 K up to ambient. Composite thermal conductivities κ_c(T) can be as high as 860 W m^-1 K^-1 at roughly 100 K for Al/diamond and 1100 W m^-1 K^-1 for Ag–Si/diamond at approx. 150 K. Although the Si concentration in the matrix plays an eminent role for κ_c(T), i.e. the lower the Si concentration, the higher κ_c(T), interface thermal conductance is almost unaffected in the reactive Al-diamond system. Furthermore, they are close to values determined on clean model systems, i.e. sputtered and evaporated metal layers on diamond monocrystals. For Ag–diamond composites, the matrix composition of Ag–1Si seems to reflect an optimal composition, as the highest thermal conductivity κ_c(T) and an extraordinary higher interface conductance was achieved compared to Ag–3Si/diamond composites.

• Periodical: Materials Science Forum (Volumes 825-826)
• Pages: 197-204
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.825-826.197
• Online since: July 2015
• Authors: Christian Edtmaier*, Ernst Bauer, Zeze Serge Tako, Jakob Segl
• Keywords: Composite, Cryogenic Properties, Diamond, Thermal Conductivity

References

[1] C. Monachon, L. Weber, Influence of diamond surface termination on thermal boundary conductance between Al and diamond, J. Appl. Phys. 113 (2013) 183504.

DOI: 10.1063/1.4804061

[2] C. Monachon, G. Schusteritsch, E. Kaxiras, L. Weber, Qualitative link between work of adhesion and thermal conductance of metal/diamond interfaces, J. Appl. Phys. 115 (2014) 123509.

DOI: 10.1063/1.4869668

[3] T. Schubert, B. Trindade, T. Weißgärber, B. Kieback, Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications, Mater. Sci. Eng. A, 475 (2008) 39-44.

DOI: 10.1016/j.msea.2006.12.146

[4] R. Tavangar, J.M. Molina, L. Weber, Assessing predictive schemes for thermal conductivity against diamond-reinforced silver matrix composites at intermediate phase contrast, Scripta Mater. 56 (2007) 357-360.

DOI: 10.1016/j.scriptamat.2006.11.008

[5] P.W. Ruch, O. Beffort, S. Kleiner, L. Weber, P.J. Uggowitzer, Selective interfacial bonding in Al(Si)–diamond composites and its effect on thermal conductivity, Compos. Sci. Technol. 66 (2006) 2677-2685.

DOI: 10.1016/j.compscitech.2006.03.016

[6] C. Edtmaier, L. Weber, R. Tavangar, Surface Modification of Diamonds in Diamond/Al-Matrix Composite, Adv. Mat. Res. 59 (2009) 125-130.

DOI: 10.4028/www.scientific.net/amr.59.125

[7] C. Edtmaier, E. Bauer, L. Weber, Z.S. Tako, J. Segl, G. Friedbacher, Temperature dependence of the thermal boundary conductance in Ag–3Si/diamond composites, Diam. Relat. Mater. (2015), http: /dx. doi. org/10. 1016/j. diamond. 2015. 01. 010.

DOI: 10.1016/j.diamond.2015.01.010

[8] R.J. Stoner, H.J. Maris, T.R. Anthony, W.F. Banholzer, Measurements of the Kapitza conductance between diamond and several metals, Phys. Rev. Lett. 68 (1992) 1563-1566.

DOI: 10.1103/physrevlett.68.1563

[9] H. -K. Lyeo, D.G. Cahill, Thermal conductance of interfaces between highly dissimilar materials, Phys. Rev. B 73 (2006) 144301.

DOI: 10.1103/physrevb.73.144301

[10] B.C. Gundrum, D.G. Cahill, R.S. Averback, Thermal conductance of metal-metal interfaces, Phys. Rev. B 72 (2005) 245426.

DOI: 10.1103/physrevb.72.245426

[11] M. Kida, L. Weber, C. Monachon, A. Mortensen, Thermal conductivity and interfacial conductance of AlN particle reinforced metal matrix composites, J. Appl. Phys. 109 (2011) 064907.

DOI: 10.1063/1.3553870

[12] K.C. Collins, S. Chen, G. Chen, Effects of surface chemistry on thermal conductance at aluminum–diamond interfaces, Appl. Phys. Lett. 97 (2010) 083102.