Reorientation of Stress Induced Alignment of Thermal Donors in Silicon

Abstract:

Article Preview

Info:

Periodical:

Materials Science Forum (Volumes 83-87)

Edited by:

Gordon Davies, G.G. DeLeo and M. Stavola

Pages:

401-406

DOI:

10.4028/www.scientific.net/MSF.83-87.401

Citation:

P. Wagner et al., "Reorientation of Stress Induced Alignment of Thermal Donors in Silicon", Materials Science Forum, Vols. 83-87, pp. 401-406, 1992

Online since:

January 1992

Export:

Price:

$35.00

In order to see related information, you need to Login.