Numerical and Experimental Study of Temperature Rise Effect on Copper during Equal Channel Angular Pressing

Abstract:

The temperature rising of pure copper during equal channel angular pressing (ECAP) was investigated based on the soft DEFORM 3D. The simulation results were compared with test results, and the microstructure evolution and recrystallization process was analyzed. The experimental results showed that under the same deformation conditions, different initial states of materials had different deformation temperature raised, with which the strain state further affected the recrystallization process. In the certain scope of die channel angle, it will have an optimal grainrefinement effect. As strain increased, the material microstructure engendered a non-equilibrium structure at the macro level, and recrystallization became complicated. Control ECAP deformation parameters had an observable effect on grain refinement. After plastic deformation, the parameters of the material’s state, die structure and deformation temperature determined the material’s grain size limit. The simulated results agreed well with the experimental results.

• Periodical: Materials Science Forum (Volume 850)
• Pages: 864-870
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.850.864
• Online since: March 2016
• Authors: Ting Biao Guo, Jun Cao, Yu Tian Ding, Zhi Jia
• Keywords: Equal Channel Angular Pressing (ECAP), Recrystallization, Strain, Temperature Rise

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