Experimental Research on Dressing Parameters of the Plate in Planetary Double-Sided Grinding Process

De Bo Song; Xiang Long Zhu; Ren Ke Kang; Zhu Ji Jin; Shuang Ji Shi; Bi Zhang

doi:10.4028/www.scientific.net/MSF.874.172

Paper Titles

Feasibility of Magnetocaloric Application in the Machining Processes
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Experimental Research of Cluster Magnetorheological Finishing on Anodic Oxide Film of Aluminum
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A Novel TEM Sample Preparation by Using Micro Magnetorheological Finishing
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Experimental Research on Dressing Parameters of the Plate in Planetary Double-Sided Grinding Process
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Estimation of Unsteady and Steady Polishing Force in Magnetic Abrasive Finishing Using a Permanent Magnet End-Mill Tool
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Research Status of the Pendulum High-Speed Single Grain Test
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Effect of Li₂O, K₂O and ZnO on Vitrified Bond Composites for CBN Grinding Wheels
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Preparation and Test of Conventional Composite Abrasives Using Recycled Alumina Grains
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HomeMaterials Science ForumMaterials Science Forum Vol. 874Experimental Research on Dressing Parameters of...

Experimental Research on Dressing Parameters of the Plate in Planetary Double-Sided Grinding Process

Abstract:

Dressing parameters, which directly affect the flatness of the plate, are very important in planetary double-sided grinding dressing process. In this paper, trajectory and velocity equations of grit are studied. By comparing to the trajectory density of different annular regions, this paper puts forward an evaluation method of the shape of the plate and explores the impact of rotation speed on the shape of the plate. Finally, the experiments are performed by adjusting the rotation speed of the sun wheel and the plate. The results show that the flatness of the plate can be dressed below 0.01 mm, which validates the correctness of the theory.

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Periodical:

Materials Science Forum (Volume 874)

Pages:

172-177

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.874.172

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Online since:

October 2016

Authors:

De Bo Song, Xiang Long Zhu, Ren Ke Kang*, Zhu Ji Jin, Shuang Ji Shi, Bi Zhang

Keywords:

Dressing, Flatness, Planetary Double-Sided Grinding, Trajectory Simulation

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References

[1] G. John J, D. Kim, et al. A case for 2-body material removal in prime LED sapphire substrate lapping and polishing, J. Journal of Manufacturing Processes. (2013) 15(3): 348-354.

DOI: 10.1016/j.jmapro.2012.11.005

Google Scholar

[2] H. Kim, R. Manivannan, D. Moon, et al. Evaluation of double sided lapping using a fixed abrasive pad for sapphire substrates, J. Wear. (2013) 302(1-2): 1340-1344.

DOI: 10.1016/j.wear.2012.11.075

Google Scholar

[3] Z. C. Li, Z. J. Pei, et al. Machining processes for sapphire wafers: a literature review, J. Journal of Engineering Manufacture. (2011) 225(7): 975-989.

Google Scholar

[4] B. J. Cho, H. M. Kim, et al. On the mechanism of material removal by fixed abrasive lapping of various glass substrates, J. Wear. (2013) 302(1-2): 1334-1339.

DOI: 10.1016/j.wear.2012.11.024

Google Scholar

[5] J. H. Liu, J. D. Yang, et al. The study of lapping trace by graphic transform on double-side lapping through a planet mechanism, J. Journal of Changchun University of Science and Technology. (2002) 25(2): 40-42.

Google Scholar

[6] L. M. Ku, et al. Mathematical modeling and analysis of double-sided polishing process for 300mm silicon wafers, J. Microelectronics. (2008) (03): 373-376.

Google Scholar

[7] Y. F. Jin, et al. Motion analysis for double-sided polishing process and mathematical model establishing, J. Journal of Nanjing University of Aeronautics & Astronautics. (2005) 37(z1): 86-89.

Google Scholar

[8] Z. Q. Qi, W. J. Lu, et al. A hydrodynamic and kinematic analysis of chemical–mechanical planarization mechanism in double sided polisher, J. International Journal of Machine Tools and Manufacture. (2014) 82-83: 59-67.

DOI: 10.1016/j.ijmachtools.2014.04.001

Google Scholar