Fabrication of Cu@Sn Core-Shell Structured Particles and the Application in High Remelting Temperature Bonding

Tian Qi Hu; Hong Tao Chen; Ming Yu Li

doi:10.4028/www.scientific.net/MSF.878.3

Paper Titles

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Fabrication of Cu@Sn Core-Shell Structured Particles and the Application in High Remelting Temperature Bonding
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HomeMaterials Science ForumMaterials Science Forum Vol. 878Fabrication of Cu@Sn Core-Shell Structured...

Fabrication of Cu@Sn Core-Shell Structured Particles and the Application in High Remelting Temperature Bonding

Abstract:

A novel solder bonding material for high-temperature applications based on Cu@Sn core-shell structured particles was developed, and the fabricated Cu@Sn particles were compressed into preforms for die attachment. The reflow temperature for this bonding material could reached as low as 260°C due to the low melting temperature of the outer Sn layer. However, after reflow soldering, the resulting interconnections can withstand a high temperature of at least 415°C, outer Sn layer completely transformed into Cu-Sn intermetallic compounds (IMCs) with high remelting temperatures. The formed bondlines exhibit good electrical conductivity due to the low porosity and the embedded Cu particles in the interconnections. Furthermore, the interconnections also exhibit excellent reliability under thermal shock cycling from-55°C to 200°C. This die attach material is suitable for power devices operating under high temperatures or other harsh environments.

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Periodical:

Materials Science Forum (Volume 878)

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3-7

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.878.3

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Online since:

November 2016

Authors:

Tian Qi Hu, Hong Tao Chen*, Ming Yu Li

Keywords:

Bonding Process, Cu@Sn, Die Attach, High-Temperature Solder, Power Electronics

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