Numerical Simulation of Temperature Field and Microstructure of a Wide Copper Plate during Warm Mold Continuous Casting

Abstract:

Wide plates are mainly prepared through traditional cold mold continuous casting technology. A problem is cracking which caused by the non-uniform temperature field in solidification. Warm mold continuous casting is a new technology. Warm mold continuous casting of wide copper plate (section 500mm×12mm) was studies. Temperature field, solid/liquid interface and microstructure were analyzed by ProCAST software. By simulation, the optimal processing parameters: withdrawing speed was 60-80 mm/min, and the temperature of copper melt, mold and cooling water were 1200°C, 800-900oC and 20 oC, respectively. The temperature field in the width direction of the copper plate broad face was uniform, and the temperature decreased uniformly along the withdrawing direction. The temperature difference between center and edge was within 10 oC, and the temperature difference between narrow and broadfaces was within 25oC. Microstructure of plate contained ‘bamboo-like’ grains along the withdrawing direction.

• Periodical: Materials Science Forum (Volume 898)
• Pages: 1289-1299
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.898.1289
• Online since: June 2017
• Authors: Feng Yi, Xue Feng Liu*
• Keywords: Numerical Simulation, Warm Mold Continuous Casting, Wide Copper Plate

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