Effect of SiC Whiskers on the Microstructure and Thermal Conductivity of Carbon Foam

Sheng Jie Yu; Zhao Feng Chen; Yang Wang

doi:10.4028/www.scientific.net/MSF.917.106

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HomeMaterials Science ForumMaterials Science Forum Vol. 917Effect of SiC Whiskers on the Microstructure and...

Effect of SiC Whiskers on the Microstructure and Thermal Conductivity of Carbon Foam

Abstract:

This paper describes the modification of ultralight flexible carbon foam by chemical vapor deposition (CVD) of silicon carbide whiskers (SiC_w). The effect of SiC whiskers on the microstructure and the thermal conductivity of carbon foam were investigated by scanning electron microscopy (SEM) and laser flash diffusivity method in a Netzsch LFA427. The results show that the macro-pores (~30 μm) of the carbon foam were divided by the random distribution of SiC whiskers. The diameter of SiC whiskers decreased with decreasing catalyst concentration which resulted in the improved microstructure with a smaller pore diameter (4~6 μm) and a more homogeneous distribution of the pores. The carbon foam reinforced by SiC_w exhibits better insulation performance than the pristine carbon foam when the temperature exceeds 200°C.

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Materials Science Forum (Volume 917)

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106-111

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https://doi.org/10.4028/www.scientific.net/MSF.917.106

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Online since:

March 2018

Authors:

Sheng Jie Yu, Zhao Feng Chen*, Yang Wang

Keywords:

Carbon Foam, CVD, Microstructure, SiC Whiskers, Thermal Conductivity

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