The Soaking Process Optimization for the Conductive Slip-Ring

Li Peng Zhang; Bin Hong; Kun Liang Zhang; Jian Ye Gao; Ya Ji; Zhen Dong Gao

doi:10.4028/www.scientific.net/MSF.943.53

Paper Titles

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Study on Wrinkles during Rotary-Draw Bending Forming
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The Pouring Process Optimization for the Conductive Slip-Rin
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The Soaking Process Optimization for the Conductive Slip-Ring
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Modeling and Investigation of the Process of Hot Rolling of Large-Sized Ingots from Aluminum Alloy of the Al-Mg System, Economically Alloyed by Scandium
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Evaluation of Surface Roughness and Tool Wear in High Speed Machining of Inconel 718
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Effect of Compressive and Shear Deformation of 2.5D Preform on its Stiffness of Composites
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Study on Mechanical Properties of 3D4d Woven SiC_f/SiC Composites Based on Experiment and Model Prediction
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HomeMaterials Science ForumMaterials Science Forum Vol. 943The Soaking Process Optimization for the...

The Soaking Process Optimization for the Conductive Slip-Ring

Abstract:

Due to its specific structural features, the packaging technology is extraordinary significant for the conductive slip-ring (CSR) encapsulating with epoxy molding compounds (EMC). In this work, a modified vacuum packaging technology was put forward for which includes a soaking process.By the construction of the soaking models, the packaging technology was calculated by MATLAB and discussed. The soaking model reveals that the soaking time is strongly influenced by the space of the exhaust vent and the added pressure. When the soaking pressure is set at 6 atm with the vent of 0.02 mm width, the EMC can be completely soaked into the tiny spaces of the CSR in 5 min.

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Periodical:

Materials Science Forum (Volume 943)

Pages:

53-57

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.943.53

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Online since:

January 2019

Authors:

Li Peng Zhang, Bin Hong*, Kun Liang Zhang, Jian Ye Gao, Ya Ji, Zhen Dong Gao

Keywords:

Conductive Slip-Ring, Epoxy Molding Compounds, Packaging Technology, Pouring Model, Soaking Model

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