The Pouring Process Optimization for the Conductive Slip-Rin

Kun Liang Zhang; Bin Hong; Li Peng Zhang; Ya Ji; Zhen Dong Gao; Jian Ye Gao

doi:10.4028/www.scientific.net/MSF.943.48

Paper Titles

Effect of Laser Shock Peening on Surface Residual Stress and Plastically Affected Depth of TC11 Titanium Alloy
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Improved Workability of Diameter-Enlarged Process for S35C through Quenching and Tempering Heat Treatment
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Influence of Fillet Radius of Die End on Workability of Diameter-Enlarged Process
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Study on Wrinkles during Rotary-Draw Bending Forming
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The Pouring Process Optimization for the Conductive Slip-Rin
p.48

The Soaking Process Optimization for the Conductive Slip-Ring
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Modeling and Investigation of the Process of Hot Rolling of Large-Sized Ingots from Aluminum Alloy of the Al-Mg System, Economically Alloyed by Scandium
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Evaluation of Surface Roughness and Tool Wear in High Speed Machining of Inconel 718
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Effect of Compressive and Shear Deformation of 2.5D Preform on its Stiffness of Composites
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HomeMaterials Science ForumMaterials Science Forum Vol. 943The Pouring Process Optimization for the...

The Pouring Process Optimization for the Conductive Slip-Rin

Abstract:

Based on its specific structural features, the packaging technology is extraordinary significant for the conductive slip-ring (CSR) encapsulating with epoxy molding compounds (EMC). In this work, a modified vacuum packaging technology has been proposed which includes a pouring process.By the construction of the relevant models, the packaging technology was calculated by MATLAB and discussed. It indicates that the EMC can be easily poured into the concentric ring slit of the CSR only with a differential pressure of 200 Pa between the outside pressure and the inside pressure. On the bases of the experimental results; the EMC can easily flow up from the bottom to the top of the CSR packaging mold vertically.

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Periodical:

Materials Science Forum (Volume 943)

Pages:

48-52

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.943.48

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Online since:

January 2019

Authors:

Kun Liang Zhang, Bin Hong*, Li Peng Zhang, Ya Ji, Zhen Dong Gao, Jian Ye Gao

Keywords:

Conductive Slip-Ring, Epoxy Molding Compounds, Packaging Technology, Pouring Model

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