Study on the Transparent Electronic Isolation Layer Material - A Photoresist Composition which is Stable at High Temperature and Humidity

Abstract:

A negative resist composition composed of an acrylic-copolymer-binder resin, a crosslinker, photoinitiators, some agents and solvents has been UV-cured and developed for OverCoat (OC)-Bridge of One Glass Solution (OGS) touch panel (TP) sensor, wherein acrylic-copolymer-binder resin as a key element consisting of N-Phenylmaleimide (N-Pm), Methacrylic acid (MA), Styrene (St) and Isobornyl methacrylate (iBMA) monomers, being designed and synthesized to control the acid value (90-110mgKOH/g), molecular weight (Mw:10,000-20,000) and approximate solubility parameter [10.67-11.05(cal/cm3)1/2]. Here,we demonstrate a OC photoresist applies between two ITO line-films by UV-curing process technology deveoled for OC-Bridge pattern with a kind of acrylic-copolymer-binder resin by ours. Acting as TP sensor, the OC patterns have adequate resistance to solvents, acids and alkalis, good thermal and humid stability, and with excellent transparency and insulation. This OC photoresist, coupled with the acrylic-copolymer-binder resins, provides an unprecedented approach to realize supporting high temperature and humidity OC-Bridge.

• Periodical: Materials Science Forum (Volume 980)
• Pages: 44-57
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.980.44
• Online since: March 2020
• Authors: Wei Li*, Da Hong Li, Jian Ping Cao, Xiang Jun Yun, Pawan Kunmar
• Keywords: Binder Resin, High Temperature, Humidity, Isolation Layer, OC Photoresist, One Glass Solution (OGS), UV-Curing Process

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