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Metal Foam and Nanoparticles Reinforced PCM for Electronic Components Thermal Management

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Abstract:

This paper presents a numerical study on the passive cooling of an electronic component inside a rectangular enclosure filled with phase change material (PCM). The electronic component is centrally located on a substrate and generates volumetric heat. The study utilizes the enthalpy-porosity approach and the thermal equilibrium model. Its goal is to enhance the performance of the PCM by incorporating metal foam and nanoparticles. The investigation examines the impact of varying metal foam porosity while keeping the nanoparticle volume fraction constant. The results indicate that a lower porosity (0.85) significantly improves the thermal conductivity of the PCM by 3 times, which increases the cooling efficiency of the PCM-based heat sink. Meanwhile, nanoparticles have a negligible effect when metal foam is present.

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Nano Hybrids and Composites Vol. 49 View Preview

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Periodical:

Nano Hybrids and Composites (Volume 49)

Pages:

15-25

DOI:

https://doi.org/10.4028/p-LOx3sp

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Online since:

December 2025

Authors:

Ibtissam Afaynou*, Hamza Faraji, Khadija Choukairy, Mohamed Bourich, Mustapha El Alami

Keywords:

Effective Thermal Conductivity, Electronic Component, Enhanced Heat Transfer, Metal Foam, Nanoparticle, Phase Change Material, Thermal Management

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© 2025 Trans Tech Publications Ltd. All Rights Reserved

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* - Corresponding Author

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