Direct Wafer Bonding for Nanostructure Preparations
Direct Wafer Bonding has been widely developed and is very attractive for a lot of applications. Using original techniques based on direct bonding enable to carry out specific engineered substrates. Various illustrations are given among which twisted Si-Si bonded substrates, where buried dislocation networks play a key role in the subsequent elaboration of nanostructures.
Chunli BAI, Sishen XIE, Xing ZHU
H. Moriceau et al., "Direct Wafer Bonding for Nanostructure Preparations", Solid State Phenomena, Vols. 121-123, pp. 29-32, 2007