Difference in Annealing Characteristics of Nanostructured Copper Alloys Processed by Accumulative Roll Bonding

Seong Hee Lee; S.Z. Han; Cha Yong Lim

doi:10.4028/www.scientific.net/SSP.124-126.1373

Paper Titles

Tensile Properties of Friction Stir Welded AZ31B Mg Alloy
p.1357

Influence of Thixoextrusion Parameters on Mechanical Properties of Thixoextruded 7075 Al Wrought Alloy
p.1361

High Temperature Deformation Behavior of M2 High-Speed Tool Steel
p.1365

Fatigue Behavior of Thin Cu Foils for Flexible Printed Circuit Board
p.1369

Difference in Annealing Characteristics of Nanostructured Copper Alloys Processed by Accumulative Roll Bonding
p.1373

Effects of Oxygen on Phase Stability and Mechanical Properties of Quenched Ti-Nb Alloys
p.1377

Assessment of Tensile and Fatigue Damage in 316L Stainless Steel by Acoustic Emission Technique
p.1381

Fatigue Crack Growth of Ultrafine Grained Pure Ti after Severe Plastic Deformation
p.1385

Tribological Characteristics of Coarse and Ultra-Fine Grained Ferrite-Martensite Dual Phase Steel Fabricated by Equal Channel Angular Pressing
p.1389

HomeSolid State PhenomenaSolid State Phenomena Vols. 124-126Difference in Annealing Characteristics of...

Difference in Annealing Characteristics of Nanostructured Copper Alloys Processed by Accumulative Roll Bonding

Abstract:

The difference in annealing characteristics of oxygen free copper (OFC) and deoxidized low-phosphorous copper (DLP) processed by ARB was studied. The copper alloys processed by eight cycles of the ARB were annealed for 10 minutes at various temperatures ranging from 100 to 400°C. The variation of microstructure and mechanical properties with annealing was significantly different in both copper alloys. In case of OFC, the ultrafine grained (UFG) structure formed by the ARB still remained up to 200°C, and above 200°C it was completely replaced with a coarse grained structure due to an occurrence of the conventional recrystallization. However, in case of DLP, the recrystallization did not occur even at 350°C. The strength of the OFC also decreased significantly at annealing temperatures above 200°C, while the hardness of the DLP did not decrease so largely up to 350°C. These differences in annealing characteristics in both copper alloys were discussed in terms of purity.

You might also be interested in these eBooks

Advances in Nanomaterials and Processing

View Preview

Info:

Periodical:

Solid State Phenomena (Volumes 124-126)

Pages:

1373-1376

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.124-126.1373

Citation:

Cite this paper

Online since:

June 2007

Authors:

Seong Hee Lee, S.Z. Han, Cha Yong Lim

Keywords:

Accumulative Roll Bonding (ARB), Copper Alloy, Mechanical Property, Ultrafine Grained

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] V. M. Segal: Mater. Sci. Eng., Vol. A197 (1995), p.157.

Google Scholar

[2] R. Z. Valiev, R.K. Islamgaliev and I.V. Alexandrov: Progress in Materials Science, Vol. 45 (2000), p.103.

Google Scholar

[3] Z. Horita, D. J. Smith, M. Furukawa, M. Nemoto, R. Z. Valiev and T. G. Langdon: J. Mater. Res., Vol. 11 (1996), p.1880.

Google Scholar

[4] R. Z. Abdulov, R. Z. Valiev and N.A. Krasilnilov, Mater. Sci. Lett., Vol. 9 (1990), p.1445.

Google Scholar

[5] Y. Saito, H. Utsunomiya, N. Tsuji and T. Sakai: Acta Mater., Vol. 47 (1999), p.579.

Google Scholar

[6] N. Tsuji, Y. Saito, H. Utsunomiya and S. Tanigawa: Scripta Mater., Vol. 40 (1999), p.795.

Google Scholar

[7] S. H. Lee, T. Sakai and Y. Saito, H. Utsunomiya and N. Tsuji: Mater. Trans., Vol. 40 (1999), p.1422.

Google Scholar

[8] Y. H. Jang, S. S. Kim, S. Z. Han, C. Y. Lim, C. J. Kim and M. Goto: Scrip. Mater., Vol. 52 (2005), p.21.

Google Scholar

[9] S. H. Lee, J. Cho, S. Z. Han and C. Y. Lim: Kor. J. Mater. Res., Vol. 15 (2005), p.240.

Google Scholar

[10] F. J. Humphreys and M. Hatherly: Recrystallization and Related Annealing Phenomena, (Elsevier Science Ltd., 2 nd ed., England), (2004).

Google Scholar