Numerical Analysis of Self-Organizing Interconnection Process by 3 Dimensional Flow Dynamics

Abstract:

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The growing importance of high integration on electronics demands novel interconnection methods replacing high-cost solder bumping or less reliable conductive adhesives. Self-organizing interconnection process using resin containing solder fillers has a possibility to achieve high-density joints satisfying both needs. Numerical study visualized the process and revealed that surface tension of molten fillers and resin viscosity determine the speed of conductive path formation.

Info:

Periodical:

Solid State Phenomena (Volumes 124-126)

Edited by:

Byung Tae Ahn, Hyeongtag Jeon, Bo Young Hur, Kibae Kim and Jong Wan Park

Pages:

543-546

DOI:

10.4028/www.scientific.net/SSP.124-126.543

Citation:

K. Ohta et al., "Numerical Analysis of Self-Organizing Interconnection Process by 3 Dimensional Flow Dynamics", Solid State Phenomena, Vols. 124-126, pp. 543-546, 2007

Online since:

June 2007

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Price:

$35.00

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