Numerical Analysis of Self-Organizing Interconnection Process by 3 Dimensional Flow Dynamics

Koushi Ohta; Kiyokazu Yasuda; Michiya Matsushima; Kozo Fujimoto

doi:10.4028/www.scientific.net/SSP.124-126.543

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HomeSolid State PhenomenaSolid State Phenomena Vols. 124-126Numerical Analysis of Self-Organizing...

Numerical Analysis of Self-Organizing Interconnection Process by 3 Dimensional Flow Dynamics

Abstract:

The growing importance of high integration on electronics demands novel interconnection methods replacing high-cost solder bumping or less reliable conductive adhesives. Self-organizing interconnection process using resin containing solder fillers has a possibility to achieve high-density joints satisfying both needs. Numerical study visualized the process and revealed that surface tension of molten fillers and resin viscosity determine the speed of conductive path formation.

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Periodical:

Solid State Phenomena (Volumes 124-126)

Pages:

543-546

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.124-126.543

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Online since:

June 2007

Authors:

Koushi Ohta, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto

Keywords:

3 Dimensional 2-Phase Flow Analasys, Resin Containing Solder Fillers, Self-Organization

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References

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[4] T. Kunugi,: ISAC '97 High Performance Computing on Multi-phase Flows (1997), pp.25-0 Normalized time, t (γfiller / ηresin) [m] Conductive path growth fraction, ggrowth [%] filler surface tension over resin viscosity, γfiller / ηresin [m/s].

57/0. 19.

57/0. 38.

57/0. 57.

57/0. 76.

285/0. 38.

19/0. 38.

1425/0. 38 Fig. 7 Normalization on quantitative evaluations.

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