Numerical Analysis of Self-Organizing Interconnection Process by 3 Dimensional Flow Dynamics
The growing importance of high integration on electronics demands novel interconnection methods replacing high-cost solder bumping or less reliable conductive adhesives. Self-organizing interconnection process using resin containing solder fillers has a possibility to achieve high-density joints satisfying both needs. Numerical study visualized the process and revealed that surface tension of molten fillers and resin viscosity determine the speed of conductive path formation.
Byung Tae Ahn, Hyeongtag Jeon, Bo Young Hur, Kibae Kim and Jong Wan Park
K. Ohta et al., "Numerical Analysis of Self-Organizing Interconnection Process by 3 Dimensional Flow Dynamics", Solid State Phenomena, Vols. 124-126, pp. 543-546, 2007