Effect of Dissolution on the Ni3Sn4 Growth Kinetics at the Interface of Ni and Liquid Sn-Base Solders
The Ni3Sn4 intermetallic layer occurs at the interface of nickel and the saturated or undersaturated Sn-base solder melt at 250-450 °C and dipping times of 300 to 2400 s. Mathematical equations are proposed to evaluate the thickness of the Ni3Sn4 layer formed under conditions of simultaneous dissolution in the undersaturated solder melt.
J. Čermák and I. Stloukal
V. I. Dybkov "Effect of Dissolution on the Ni3Sn4 Growth Kinetics at the Interface of Ni and Liquid Sn-Base Solders ", Solid State Phenomena, Vol. 138, pp. 153-158, 2008