Effect of Dissolution on the Ni3Sn4 Growth Kinetics at the Interface of Ni and Liquid Sn-Base Solders

Vasil I. Dybkov

doi:10.4028/www.scientific.net/SSP.138.153

Paper Titles

On Specific Phase Transitions to the Compound-Like Impurity Nanosegregation Structures at Dislocations and Grain Boundaries in Metals and their Influence on Diffusion-Assisted Processes
p.91

Diffusion of Light Elements in BCC, FCC and HCP Metals
p.119

Analysis of Possibilities of Fisher’s Model Development
p.133

Structural Evolution of Al-Cr Alloy during Processing
p.145

Effect of Dissolution on the Ni₃Sn₄ Growth Kinetics at the Interface of Ni and Liquid Sn-Base Solders
p.153

On the Physicochemical Mechanism of the Influence of Preliminary Mechanical Activation on Self-Propagating High-Temperature Synthesis
p.159

Solid State Transformations in Cu/In-48Sn/Cu Diffusion Soldered Interconnections
p.165

Solid Phase’s Transformations in Boron Carbide Based Composites during Heat Treatment
p.175

Diffusional Growth Kinetics of Boride Layers on Iron-Chromium Alloys
p.181

HomeSolid State PhenomenaSolid State Phenomena Vol. 138Effect of Dissolution on the Ni3Sn4 Growth...

Effect of Dissolution on the Ni₃Sn₄ Growth Kinetics at the Interface of Ni and Liquid Sn-Base Solders

Abstract:

The Ni3Sn4 intermetallic layer occurs at the interface of nickel and the saturated or undersaturated Sn-base solder melt at 250-450 °C and dipping times of 300 to 2400 s. Mathematical equations are proposed to evaluate the thickness of the Ni3Sn4 layer formed under conditions of simultaneous dissolution in the undersaturated solder melt.

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Periodical:

Solid State Phenomena (Volume 138)

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153-158

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.138.153

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Online since:

March 2008

Authors:

Vasil I. Dybkov

Keywords:

Growth Kinetic, Liquid Sn-Base Solders, Ni₃Sn₄ Intermetallic Layer

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