Solid State Transformations in Cu/In-48Sn/Cu Diffusion Soldered Interconnections

Abstract:

Paper describes solid state phenomena occurring during the formation of interconnections intended to the electronic industry. Diffusion soldering technology is an undemanding and functional tool to use when the growth of intermetallic phase(s) is desired and controlled in order to obtain the joint consisted solely of an intermetallic phase. Scanning and transmission electron microscopy investigations of the microstructure and sequence of appearance of the intermetallics within the joined area are discussed. The diffusion path describing the chemical composition changes across the interconnection was found to correlate with microstructure transformations. The growth kinetics of the δ′[Cu41(Sn,In)11] phase was determined in the temperature range of 300 – 350 °C.

• Periodical: Solid State Phenomena (Volume 138)
• Pages: 165-174
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.138.165
• Online since: March 2008
• Authors: Joanna Wojewoda
• Keywords: Diffusion Path, Diffusion Soldering, Growth Kinetics of the Intermetallic Phases, Intermetallic

References

[1] G. Humpsten and D.M. Jacobson: Principles of Soldering and Brazing (ASM International, Materials Park, OH 1993).

[2] D. M Jacobson and S.P. S Sangha: Novel Applications of Diffusion Soldering (GEC-Marconi Materials Technology Ltd, Hirst Division, Hertfordshire, England 1995).

[3] P.K. Khanna, S.K. Bhatnagar, G. Dalke, D. Brunner and W. Gust: Mat. Sci. Eng. B Vol. 33 (1995), p. l6.

[4] S.K. Kang, W.K. Choi, D.Y. Shih, D.W. Henderson, T. Gosselin, A. Sarkhel, C. Goldsmith and K.J. Puttlitz: JOM Vol. 55 (2003), p.61.

DOI: 10.1007/s11837-003-0143-6

[5] COST 531 Lead free solder materials, database.

[6] J. Wojewoda and P. Zięba: InŜynieria Materiałowa Vol. 24 (2004), p.460.

[7] H. Fidos and H. Schreiner: Z. Metallkd. Vol. 61 (1971), p.225.

[8] S. Bader, W. Gust and H. Hieber: Acta Metall. Mater. Vol. 43 (1995), p.329.

[9] C.R. Kao: Mat. Sci. Eng. A Vol. 238 (1997), p.196.

[10] D. Gur and M. Bamberger: J. Mater. Sci. Vol. 35 (2000), p.4601.

[11] P.G. Kim and K.N. Tu: Mater. Chem. Phys. Vol. 53 (1998), p.165.

[12] J.A. van Beck, S.A. Stolk and F.J.J. van Loo: Z. Metallkd. Vol. 73 (1982), p.439.

[13] T. Ishida: Trans. JIM Vol. 14 (1973), p.37.

[14] C. Tsao and S. Chen: J. Mater. Sci. Vol. 30 (1995), p.5215.

[15] Y.M. Liu and T.H. Chuang: J. Electron. Mater. Vol. 29 (2000), p.405.

[16] Y.H. Tseng, M.S. Yeh and T.H. Chuang: J. Electron. Mater. Vol. 28 (1999), p.105.

[17] H.K. Kim, H.K. Liou and K.N. Tu: Appl. Phys. Lett. Vol. 66 (1995), p.2337.

[18] M. Schaefer, R.A. Fournelle and J. Liang: J. Electron. Mater. Vol. 27 (1998), p.1167.

[19] A.D. Romig Jr., F.G. Yost and P.F. Hlava, in: Proc. Microbeam Analysis 1984, edited by A.D. Romig, Jr. and J.I. Goldstein, San Francisco Press, CA, San Francisco (1984).

[20] J.B. Clark: Trans. Metal. Soc. AIME Vol. 227, (1963) 1250.

[21] B. Pieraggi: Oxid. Met. Vol. 27 (1987), p.177.

[22] S. Sommadossi, W. Gust and E.J. Mittemeijer: Mater. Chem. Phys. Vol. 77 (2002), p.924.