Microstructure Evolution and Mechanical Properties of the Ni/Ni Soldered Joints

Anna Sypień; Andrzej Piątkowski; Paweł Zięba

doi:10.4028/www.scientific.net/SSP.172-174.863

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HomeSolid State PhenomenaSolid State Phenomena Vols. 172-174Microstructure Evolution and Mechanical Properties...

Microstructure Evolution and Mechanical Properties of the Ni/Ni Soldered Joints

Abstract:

The paper presents the results of studies on the microstructure, chemical composition and mechanical properties of the Ni/SnAuCu/Ni interconnections obtained due to the conventional soldering at 300 °C for different times and subsequent aging at 150 °C. The EDX microanalysis allowed to detect at the Ni/solder interface the (Ni,Cu,Au)₃Sn₄ phase which transformed to (Cu,Ni,Au)₆Sn₅ after longer time of soldering. In the central part of the interconnection AuSn₄ brittle phase was present. This phase was responsible for the significant decrease of the shear strength in the joints subjected to aging at 150 °C for 1000h, 1500 hours. The fracture behavior of such joints appeared to be caused partly by the coalescence of the microvoids in the bulk solder, cleavage of η-phase grains and decohesion at the interface.

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Periodical:

Solid State Phenomena (Volumes 172-174)

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863-868

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https://doi.org/10.4028/www.scientific.net/SSP.172-174.863

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Online since:

June 2011

Authors:

Anna Sypień, Andrzej Piątkowski, Paweł Zięba

Keywords:

High-Temperature Soldering, Material Property, Pb-Free SnAuCu Solder Alloys

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