Molecular Dynamics Simulation of Nano-Grinding with Multiple Abrasive Grains

Abstract:

During grinding a large number of micrometer or sub-micrometer grains remove material from the surface of a workpiece, acting as cutting tools. As the grains perform the material removal process, the alterations on the workpiece surface are correlated to the grain characteristics, as well as process parameters. In the case of nano-grinding, only several atomic layers are removed and surface quality of nanometer level is attained. For this process, simulations can be carried out with Molecular Dynamics method, with a view to determine its characteristics. In the present study, the case of peripheral nano-grinding of a copper substrate with multiple abrasive grains is investigated for various depths of cut (namely 0.35, 0.54 and 0.72 nm) and results concerning grinding forces, temperature and workpiece deformation are presented and discussed. Cutting forces, temperature and workpiece deformation was observed to increase between the cases with 0.54 and 0.72 nm depth of cut to a greater extent than between the cases with 0.35 and 0.54 nm depth of cut.

• Periodical: Solid State Phenomena (Volume 261)
• Pages: 115-120
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.261.115
• Online since: August 2017
• Authors: Nikolaos E. Karkalos, Angelos P. Markopoulos*
• Keywords: Abrasive Grains, Molecular Dynamics, Nano-Grinding, Nanometric Material Removal, Ultra-Precision Grinding

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