Influence of Indium and Antimony Additions on Mechanical Properties and Microstructure of Sn-3.0Ag-0.5Cu Lead Free Solder Alloys

Abstract:

In this research, we investigated the influence of indium and antimony additions on the microstructure, mechanical and thermal properties of Sn-3.0Ag-0.5Cu lead free solder alloys. The results revealed that the addition of 0.5 wt.%InSb into SAC305 solder alloys resulted to a reduced melting temperature by 3.8 °C and IMCs phases formed new Ag₃(Sn,In) and SnSb in the Sn-rich matrix with a decreased grain size of 28%. These phases improved the mechanical properties of solder alloys. In addition, the mechanical properties of SAC305 solder alloys increased by adding 0.5 wt.%InSb, resulting in an increase of ultimate tensile strength of 24%, but the percent elongation decreased to 45.8%. Furthermore, the Vickers microhardness slightly increased of the SAC305 solder alloys.

• Periodical: Solid State Phenomena (Volume 266)
• Pages: 196-200
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.266.196
• Online since: October 2017
• Authors: Suchart Chantaramanee*, Phairote Sungkhaphaitoon, Thawatchai Plookphol
• Keywords: Intermetallic Compounds, Lead-Free Solder, Mechanical Properties, Sn-Ag-Cu Alloys

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