Microstructure, Interfacial IMC and Wettability of Sn-0.7Cu-xZn Solder Alloy

Abstract:

In this study, the effect of Zinc (Zn) addition on microstructure, interfacial IMC and wettability properties of Sn-0.7Cu lead free solder alloy was investigated. The addition of 0.5, 1.0 and 1.5 wt.% Zn into Sn-0.7Cu was developed by using conventional casting method. The result revealed that the addition of Zn has refined the β-Sn phase. The thickness of interfacial IMC decreased with 0.5 wt.% and 1.0 wt.% Zn addition but increased after 1.5 wt.% of Zn was added. The wettability of Sn-0.7Cu also improved by the Zn addition. It can be concluded that a small amount of Zn addition up to 1.0 wt.% decreased the thickness of IMC and improved the wettability. However, when 1.5 wt.% Zn was added, the interfacial IMC and wettability become worse.

• Periodical: Solid State Phenomena (Volume 280)
• Pages: 157-162
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.280.157
• Online since: August 2018
• Authors: Mohd Izrul Izwan Ramli*, Mohd Arif Anuar Mohd Salleh, I.N.A. Ibrahim, Rita Mohd Said
• Keywords: Intermetallic Compound, Sn-0.7Cu, Solder Alloy, Zinc

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