Thermal and Electrical Characterization of Zn-Cu Ferrites Thin Films

Abstract:

The effects of Zn and Cu on the thermoelectric properties of ferrite thin films were studied in this paper. The Zn-Cu ferritethin film was fabricated using ink-jet printing method. A minimum of 50 print cycles was required to obtain continuous film with approximately 9 μm thick thin films. The thickness of Zn-Cu ferrite thin films was decreased with increasing sintering temperature from 200 oC (9.21 μm) to 400 oC (5.48 μm). The XRD traces of Zn_xCu_1-xFe₂O₄ exhibit as plane reflection for cubic spinel phase of Zn_xCu_1-xFe₂O₄ and there were no impurity peaks detected with increasing Zn content and sintering temperature. The electrical conductivity of Zn_xCu_1-xFe₂O₄ thin film decreased from 1.18x10^-3 S/cm (x=0.0) to 0.48x10^-3 S/cm (x=1.0) with increasing Zn content. Positive Seebeck values were observed for all the samples, which indicated the samples were p-type. The Seebeck coefficient of Zn_xCu_1-xFe₂O₄ thin film increased from 6.36 μV/K (x=0.0) to 17.46 μV/K (x=1.0) with increasing Zn content.

• Periodical: Solid State Phenomena (Volume 280)
• Pages: 90-95
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.280.90
• Online since: August 2018
• Authors: L.J. Hoong*, Yeoh Cheow Keat, Abdullah Chik, Pei Leng Teh
• Keywords: Ink-Jet Printing, Thermoelectric, Thin Films, Zn-Cu Ferrite

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