Tribological Characterization of Anionic Supramolecular Assemblies in Post-STI-CMP Cleaning Solution Using a Novel Post-CMP PVA Brush Scrubber

Ara Philipossian; Yasa Sampurno; Sian Theng; Fransisca Sudargho; Katherine M. Wortman-Otto; Carolyn Graverson; Jason J. Keleher

doi:10.4028/www.scientific.net/SSP.314.264

Paper Titles

Contact Vs. Non-Contact Cleaning: Correlating Interfacial Reaction Mechanisms to Processing Methodologies for Enhanced FEOL/BEOL Post-CMP Cleaning
p.237

Effect of Viscosity on Ceria Abrasive Removal in the Buffing CMP Process
p.247

Nodule Deformation of PVA Roller Brushes on a Rotating Plate: Optimum Cleaning for Nanosized Particles due to Liquid Absorption and Desorption of Sponge Deformation
p.253

Mechanism of PVA Brush Loading with Ceria Particles during Post-CMP Cleaning Process
p.259

Tribological Characterization of Anionic Supramolecular Assemblies in Post-STI-CMP Cleaning Solution Using a Novel Post-CMP PVA Brush Scrubber
p.264

Effect of Dissolved Oxygen on Removal of Benzotriazole from Co during a Post-Co CMP Cleaning
p.270

Removal of Post Etch Residue on BEOL Low-K with Nanolift
p.277

Copper Catalysis Effect Investigation for TiW Etch Process on Patterned Wafers
p.282

Selective Nickel Platinum Removal without Titanium Nitride Metal Gate Corrosion
p.289

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Tribological Characterization of Anionic Supramolecular Assemblies in Post-STI-CMP Cleaning Solution Using a Novel Post-CMP PVA Brush Scrubber

Abstract:

We have shown how different micellar (SDBS) vs. polyelectrolytic (PSSA) supramolecular assemblies in post-CMP cleaning solutions differ in their tribological performance when used in a novel PVA scrubber for 300-mm silicon dioxide wafer cleaning. Significant differences in real-time shear force and coefficient of friction data from the wafer-solution-brush interface (both in time domain as well as frequency domain) have been attributed to differences in each supramolecule’s chemical functionality and structure, which in turn, have been correlated to wafer-level defects. The work has underscored the importance of measuring the tribological attributes of post-CMP cleaning processes in an effort to improve cleaning performance.

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Periodical:

Solid State Phenomena (Volume 314)

Pages:

264-269

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.314.264

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Online since:

February 2021

Authors:

Ara Philipossian*, Yasa Sampurno, Sian Theng, Fransisca Sudargho, Katherine M. Wortman-Otto, Carolyn Graverson, Jason J. Keleher

Keywords:

Brush, Coefficient of Friction, Micelle, Polyelectrolyte, Post-CMP Cleaning, PVA, Scrubbing, Shear Force, Supramolecular Assemblies

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References

[1] S.R. Alety, K.V. Sagi, S.V. Babu, Role of Ce3+ ions in achieving high silicon nitride polish rates, ECS J. Solid State Sci. Technol. 6 (2017) 898–903.

DOI: 10.1149/2.0351712jss

Google Scholar

[2] J. Seo, A. Gowda, S.V. Babu, Almost complete removal of ceria particles down to 10 nm size from silicon dioxide surfaces, ECS J. Solid State Sci. Technol. 7 (2018) 243–252.

DOI: 10.1149/2.0131805jss

Google Scholar

[3] G. Zhang, G. Burdick, F. Dai, T. Bibby, S. Beaudoin, Assessment of post-CMP cleaning mechanisms using statistically-designed experiments, Thin Solid Films, 332 (1998) 379–384.

DOI: 10.1016/s0040-6090(98)01038-4

Google Scholar

[4] W.-T. Tseng, C. Wu, T. McCormack, J.C. Yang, Post cleaning for FEOL CMP with silica and ceria slurries, ECS J. Solid State Sci. Technol. 6 (2017) 718–722.

DOI: 10.1149/2.0101710jss

Google Scholar

[5] C.F. Graverson, K.M. Wortman-Otto, A.N. Linhart, T.B. Zubi, J.J. Keleher, Development of soft, cleaning chemistries for enhanced STI post-CMP cleaning, ECS Trans. 92 (2019) 165-174.

DOI: 10.1149/09202.0165ecst

Google Scholar

[6] Araca, Inc. website, 2020, reproduced as: http://aracainc.com/equipment/rd-post-cmp-pva-brush-scrubber/.

Google Scholar

[7] Struers, Inc. website, 2020, reproduced as: https://www.struers.com/en/Products/Grinding-and-Polishing/Grinding-and-polishing-equipment/LaboSystem#.

Google Scholar

[8] Tekscan, Inc. website, 2020, reproduced as: https://www.tekscan.com/products-solutions/ pressure-mapping-technology.

Google Scholar

[9] Entegris, Inc. website, 2020, reproduced as: https://www.entegris.com/shop/en/USD/products/wafer-handling/wafer-processing/post-cmp-cleaning-brushes/Planarcore-PVA-Brushes/p/PlanarcorePVABrushes?industry=.

Google Scholar