Controlled and Uniform Wet Etching of Molybdenum Nanowires

Article Preview

Abstract:

We achieved the controlled recess of molybdenum (Mo), which is alternative interconnect material for copper (Cu), by wet chemical etching. This wet etching process includes two main steps which are chemical oxidation of Mo and its subsequent dissolution, respectively. Firstly, Mo nanowires (NWs) are uniformly oxidized with potassium permanganate (KMnO4) solution in acetone. Secondly, the Mo oxide is dissolved using an aqueous solution of HCl. Mo NWs are characterized through transmission electron microscopy (TEM) imaging after each of the above steps. Cyclic etching experiments including oxidation and dissolution of Mo showed that Mo recess is linear and can be controlled for each cycle, where the etching produced the smooth Mo surface. This controlled Mo recess is crucial for the fabrication of next-generation metal interconnects.

You might also be interested in these eBooks

Info:

Periodical:

Solid State Phenomena (Volume 346)

Pages:

351-355

Citation:

Online since:

August 2023

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2023 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] D. S. Kim, J. E. Kim, Y. J. Gill, et al. Anisotropic/isotropic atomic layer etching of metals. Applied Science and Convergence Technology, 2020, 29, 41.

DOI: 10.5757/asct.2020.29.3.041

Google Scholar

[2] A. Pacco, T. Nakano, A. Iwasaki, et al. Controlled ALE-type recess of molybdenum for future logic and memory applications. 2021 IEEE International Interconnect Technology Conference, Kyoto, Japan, 2021, 1.

DOI: 10.1109/iitc51362.2021.9537407

Google Scholar

[3] A. Iwasaki, Y. Akanishi, F. Mazzamuto, et al. Study of copper surface preparation by sequential atomic layer wet etching and laser annealing treatments. ECS Transactions, 2017, 80, 233.

DOI: 10.1149/08002.0233ecst

Google Scholar

[4] A. Pacco, Y. Akanishi, Q. Le, et al, Controlled cobalt recess for advanced interconnect metallization. Microelectronic Engineering, 2019, 217, 111131.

DOI: 10.1016/j.mee.2019.111131

Google Scholar

[5] V. Founta, J. Soulié, K. Sankaran, et al. Properties of ultrathin molybdenum films for interconnect applications. Materialia, 2022, 24, 101511.

DOI: 10.1016/j.mtla.2022.101511

Google Scholar

[6] Daniel Gall. The search for the most conductive metal for narrow interconnect lines. Journal of Applied Physics, 2020, 127, 050901.

DOI: 10.1063/1.5133671

Google Scholar

[7] Z. Aabdin, X. Xu, S. Sen, et al. Transient clustering of reaction intermediates during wet etching of silicon nanostructures. Nano Letters, 2017, 17, 2953.

DOI: 10.1021/acs.nanolett.7b00196

Google Scholar

[8] Z. Aabdin, T. Ghosh, A. Pacco, et al. Controlling the wet-etch directionality in nanostructured silicon. ACS Applied Electronic Materials, 2022, 4, 5191.

DOI: 10.1021/acsaelm.2c00824

Google Scholar

[9] A. Pacco, T. Nakano, S. Iwahata, et al. Etching of molybdenum via a combination of low-temperature ozone oxidation and wet-chemical oxide dissolution. Journal of Vacuum Science & Technology A, 2023, 41, 032601.

DOI: 10.1116/6.0002404

Google Scholar