The Influence of Microstructure on Corrosion Resistance of B10 Copper Tube

Abstract:

To pinpoint the relationship between the microstructure and corrosion resistance of the B10 copper tube, the copper tubes were annealed at 780°C and 810°C, respectively. Then the simulated seawater full immersion experiment was conducted. The corrosion film, grain size, boundary characteristics, and intragranular microstructure of the alloy were analyzed by OM, SEM, EBSD, and TEM. The results implied that the corrosion rate of the 810°C annealed copper tube is about 0.028 mm/a, which is 1.9 times that of the 780°C annealed copper tube. The average grain size of 810°C annealed copper tube is about 38.85 μm and the low ΣCSL account for 64.8 %, which is 1.5 times and 1.4 times that of 780°C annealed copper tube, respectively. There is a complete spinodal decomposition structure within the grain in an 810°C annealed copper tube, but there is an incomplete spinodal decomposition structure in a 780°C annealed copper tube. Theoretical analysis indicated that the large-sized grain clusters could be formed by numerous low-layer fault energy twin boundaries Σ3, and low ΣCSL combination Σ3, Σ9, Σ27, which can block the large crystal boundaries network, inhibit the phase precipitation and prevent invading of corrosive elements along the large crystal boundaries. The intragranular spinodal decomposition structure can improve the strength and toughness of the B10 copper tube, reduce the initiation of surface microcracks during service, and thus reduce pitting and crevice corrosion.

• Periodical: Solid State Phenomena (Volume 366)
• Pages: 75-82
• DOI: https://doi.org/10.4028/p-Iu0tcH
• Online since: December 2024
• Authors: Li Min Zhang*, Cong Li
• Keywords: B10 Copper, Corrosion, Grain Boundary Characteristics, Spinodal Decomposition, ΣCSL Grain Boundaries

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