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Analysis of Generation and Propagation of Fatigue Crack in Oxygen-Free Copper Using Electron Backscattered Diffraction Method

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Abstract:

Fatigue crack generation and propagation processes in oxygen-free copper for power equipment were investigated in a time series to search for new parameters that indicate the fatigue damage degree. The damage behavior of crystal grains was observed by optical microscopy, electron backscattered diffraction (EBSD) analysis and elastic strain analysis. The obtained results suggest that the change in grain orientation spread (GOS) and grain average misorientation (GAM) values is possible to detect the fatigue crack generation. Moreover, it was found that the change in the plastic strain range is also possible to detect it.

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Info:

Periodical:

Solid State Phenomena (Volume 383)

Pages:

89-95

DOI:

https://doi.org/10.4028/p-6fnVK9

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Online since:

January 2026

Authors:

Hiroki Yonekura, Tatsuya Kobayashi, Ikuo Shohji*

Keywords:

C1020, EBSD, Elastic Strain, Fatigue Failure, Oxygen-Free Copper

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© 2026 Trans Tech Publications Ltd. All Rights Reserved

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