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Numerical Investigations of Ultrasonic Scattering from voids in Composite Materials Based on Random Void Model1 Li Lin, Xiang Zhang, Jun Chen, Ximeng Li NDT & E Laboratory, School of Materials Science & Engineering, Dalian University of Technology, Dalian, Liaoning Province, China linli@dlut.edu.cn Keywords: Composite; Porosity; Ultrasonic attenuation; Random void model; Morphology.
Even at the fixed porosity, ultrasonic attenuation coefficient fluctuates due to the randomness of void morphology in CFRP composite materials.
Komsky, "Quantitative porosity characterization of composite materials by means of ultrasonic attenuation measurements," Journal of Nondestructive Evaluation, vol. 11, pp. 1-8, 1992
Jeong, "Effects of Voids on the Mechanical Strength and Ultrasonic Attenuation of Laminated Composites," Journal of Composite Materials, vol. 31, pp. 276-292, February 1, 1997 1997
Li, "A morphology-dependent model applied to predict void content of composites based on ultrasonic attenuation coefficient: Random Void Model," Applied Physics A: Materials Science & Processing.

Materials.
Babu, The metallurgy and processing science of metal additive manufacturing, International Materials, 61 (2016), 315-360
Babu, Site specific control of crystallographic grain orientation through electron beam additive manufacturing, Materials Science and Technology 31 (2015) 931-938
Rettenmayr, Laser additive manufacturing of contact materials, Journal of Materials Processing Tech. 252 (2018) 612–617
Xu, Fabrication of WCp/NiBSi metal matrix composite by electron beam melting, Materials Science & Engineering A 666 (2016) 320–323

A Comparative Study on the Effects of FSS with Different Elements on the Characteristics of Radar Absorbing Materials Xin-yi Chen 1, a, Jian-bo Wang 1,b, Jun Lu 1,c,*, Guan-cheng Sun 1,2,d and Gui-bo Chen 1,e 1 School of Science, Changchun University of Science and technology, Changchun 130022, China 2 Key Laboratory of Optical System Advanced Manufacturing Technology Chinese Academy of Sciences, Changchun 130022, China achenxy@126.com, bwangjianbo@126.com, cjunlucc@126.com, dsunguanc@gmail.com, egbchen@yeah.net Keywords: Absorbing materials; Frequency selective surface (FSS); Resonance frequency; Bandwidth Abstract.
Among the radar absorbing materials, the thin and light materials with wide absrobing band and good absorbing ability are the objectives of the researchers who have achieved these by adopting different methods[1].
The results show that all the FSS units have great influence on the absorbing materials.
Journal of Harbin Institute of Technology, 2007，39(6): 956-959.
Materials Review, 2007, 21(1): 118-121

The presented articles consider a wide range of nanoscale materials forms: nanopowders, nanoparticles and nanofibers.
We hope this collection will be useful and interesting to many researchers and engineers in modern materials science.

Fiber Materials AC Impedance Spectroscopy and Its Application Xiaofeng Li 1,a ，Xianggao Pan 1,b 1Hunan University of Arts and Science, Changde, Hunan, China 415000 a lxfyb@21cn.com, b pxg987654321@163.com Keywords: AC impedance Spectroscopy, Bathtub effect, fibrous material, moisture regain ratio.
This article presents a recent study on the behavior of impedance versus frequency of fiber materials.
To eliminate the faults of DC impedance technique in measuring fiber moisture regain, this paper proposed a novel technique to test moisture regain of fiber materials by way of testing AC resistance.
Tong: Journal of the Chinese Cereals and Oils Association.
Chen. : Journal of Zhejiang University (Engineering Science), Vol.39(2005),P.1152

Impact Strength of Filled Polymer Materials Miroslav Müller1,a and Petr Valášek1,b 1Czech University of Life Sciences Prague, Faculty of Engineering, Department of Material Science and Manufacturing Technology, Kamýcká 129, Prague, Czech Republic amuller@tf.czu.cz, bvalasekp@tf.czu.cz Keywords: Composite systems, corundum, epoxy resin, particles.
Polymers rank among a significant group of technical materials.
Introduction Polymer materials are a significant group of technical materials.
Composite materials are promising structural components [9-10].
Characteristics of new tested composite materials Marked Characteristic of materials GER Structural two-component epoxy resin GlueEpox Rapid.

Different bonding materials and substrate materials have been chosen.
Fig 2： LED power-based bonding materials with different temperature distribution The thermal resistance of different bonding materials can be drawn, as shown in table 1.
Aknowledgement Fund: Hunan Science and Technology Plan Project (2010GK3182), Shaoyang City projects (C0926) funding.
Analysis and simulation of thermal characteristic on die bonding materials of power LED[J].
Journal of Foshan University(Natural Science Edition), 2005,23(4):14-17 [2] LI Hua-ping，CHAI Guang-yue， PENG Wen-da，et al.

Kurzydlowski Warsaw University of Technology, Faculty of Materials Science and Engineering, Woloska 141, 02507 Warsaw, Poland kjk@inmat.pw.edu.pl Keywords: composite modelling, polycrystalline metallic materials Abstract Grain boundaries significantly influence the properties of polycrystalline metallic materials, particularly with grain sizes in the nano-metre range.
Micro-macro modelling of the effects of the grain size distribution on the plastic flow stress of heterogeneous materials, Computational Materials Science Volume: 39, Issue: 1, March, (2007), 96-105 [5] Hae-Chang, C., Park, K.T.
Boundary strengthening in undeformed and deformed polycrystals, Materials Science & Engineering A Volume: 409, Issue: 1-2, November 15, (2005), 39-45 [9] Watanabe, I., Terada, K., de Souza Neto, E.A., Peric, D.
And Van der Giessen, E.: Discrete dislocation plasticity analysis of the grain size dependence of the flow strength of polycrystals, International Journal of Plasticity Volume: 24, Issue: 12, December, (2008), 2149-2172 [11] Martin, G. and Perrailon, B. in Grain Boundary Structure and Kinetics, ASM Materials Science Seminar, Milwaukee, (1979), 239 [12] ASM Handbook, volume 13 A, Corrosion: fundamentals, testing and protection, ASM International, 2003 [13] Nguyen-Manh, D., Vitek, V. and Horsfield, A.P.: Environmental dependence of bonding: A challenge for modelling of intermetallics and fusion materials, Progress in Materials Science 52, (2007), 255-298 [14] Sot, R., and Kurzydlowski, K.J.: Atomic modelling of point defects in B2-RuAl, Materials Science - Poland, 23, (2005), 407 - 411 [15] Muzyk, M. and Kurzydlowski, K.J.
Modelling the influence of the structure on the properties of nanometals, Computer Methods in Materials Science, Vol. 9, (2009), No. 1 [27] Dobosz, R.

Composite materials based on natural polysaccharides and polyguanidines are considered.
Yang, Antibacterial action of chitosan and carboxymethylated chitosan / // Journal of Applied Polymer Science. 79 (2001) 1324-1335
Xiao, Preparation of Guanidine Polymer and Its Complex as Dual-Functional Agent for Cellulose Fibre-Based Hygiene Products, Journal of Biobased Materials and Bioenergy. 5 (2011) 219-224
Khashirova, Acrylate and methacrylate guanidine-ionic liquids for dissolution of cellulose, Materials Science Forum. 935 (2018) 45-48
Khashirova, Spectrophotometric study of complex compounds of polyacrylate and polymethacrylate of guanidine, and also of composites on their basis with Fe (II) ions, Materials Science Forum. 935 (2018) 1-4.

Design and Analysis of a XY Micro-motion Stage Based on S Type Flexible Mechanism Yuemin Yu College of Science ,Heilongjiang University of Science and Technology,Harbin, 150022,China yuym2012@126.com Keywords: Micro-motion stage , Smart materials, Piezoelectric ceramic stack Abstract.
Piezoelectric materials is a kind of the most common smart materials whose geometric shape can be related to an energy input in the form of electric field.
Journal of Tianjin Vocational Technical Teachers' college, 41 (1), 1-5(2002) [3] Yu Yuemin, Ji Xiansheng Design and analysis of a micro-gripper based on smart materials [J].
Journal of Materials Processing Technology, 2005, 164(5): 1584-1589
Journal of Heilongjiang Institute of Science & Technology, Vols. 23(6):591-595 (2013)