Search results

Preface It is our pleasure to welcome all of you to attend the 2014 International Conference on Materials and Engineering Technology (MET2014) in Chicago, USA.
The MET2014 is a forum for presentation of new research results on Material Science, Communication and Information Technology, Mechatronics, Automation and Control Engineering, Power Electronics, Electrical Engineering, Embedded System, Data, Signal and Image Processing, Material and Technologies in Construction Industry and other related Engineering topics.
The rich program provided all participants to meet and discuss the advances and trends on the related areas.
The proceedings tended to collect the latest research results and applications on Material Science, Communication and Information Technology, Mechatronics, Automation and Control Engineering, Power Electronics, Electrical Engineering, Embedded System, Data, Signal and Image Processing, Material and Technologies in Construction Industry and other related Engineering topics.
Vânia Regina Salvini, São Carlos School of Engineering, University of São Paulo, Brazil Dr.

Process and Properties on the Precision Forming of Spline Cold Rolling Zhiqi Liu1,2, a, Jianli song2,b, Yongtang Li2,c, Xudong Li 1,d Mingfu Wang2,e , 1 State Key Laboratory of Gansu Advanced Non-Ferrous Metal Materials, Lanzhou University of Science & Technology, Lanzhou 730050 ,China; 2 School of Materials Science and Engineering, Taiyuan University of Science & Technology, Taiyuan 030024,China alzq_678@yahoo.com.cn, bsongjianli06@sina.com, cliyongtang@tyust.edu.cn, dlixd@lut.cn，ewmf354@163.com, Keywords: cold rolling forming, plastic flow of metals, distribution of hardness Abstract.
Cold rolling precision forming process of spline is one of the high-efficiency, precision and non-chip forming advanced manufacturing technologies.
Cold rolling precision forming of spline is a kind of high-efficiency, precision and non-chip advanced manufacturing technology.
References [1] V.V.Klepikov, A.N.Bodrov: Russian Engineering Research.
Domblesky, Feng Feng: Wire Journal International, Vol .34 (2001),p110 [5] Wu Xiuyi: Machinery Manufacturing Engineer. 1997,000 (001),p 15, in Chinese [6] Zheng Quangang: Automobile Technology & Material. 1997,000 (007),p16, in Chinese [7] Li Yongtang, Song Jianli, Zhang Dawei, et al:Materials Science Forum, 2007, 575-578,p416 [8] LIU Zhi-qi, LI Xu-dong, LI Yong-tang: Journal Of Lanzhou University Of Technology.

Higashi1 1 Graduate School of Engineering, Osaka Prefecture University, Sakai, Japan 2 School of Science and Engineering, Kinki University, Higashi-Osaka, Japan 3 Yamani Co.
Higashi: Advanced Mater.
Forum 419 (2003) p721 [7] M.
Forum 558-559 (2007) p777 [10] M.

Environmental Durability of Soil-Cement Block Incorporated With Ornamental Stone Waste Aline Carvalho1,a, Gustavo de Castro Xavier 1,b, Jonas Alexandre1,c, Leonardo Gonçalves Pedroti 2,d, Afonso Rangel Garcez de Azevedo1,e, Carlos Mauricio Fontes Vieira 2,f and Sergio Neves Monteiro 3,g 1UENF - State University of the Northern Rio de Janeiro, LECIV – Civil Engineering Laboratory; Av.
Alberto Lamego, 2000, 28013-602, Campos dos Goytacazes, Brazil. 2UENF - State University of the Northern Rio de Janeiro, LAMAV - Advanced Materials Laboratory; Av.
Alberto Lamego, 2000, 28013-602, Campos dos Goytacazes, Brazil. 2IME - Military Institute of Engineering, Department of Materials Science, Praça General Tibúrcio, 80, 22290-270, Rio de Janeiro, Brazil.
Forum Vols. 727-728 (2012), p. 619
Forum, 727-728 (2012) 809-814

Average Residual Stresses in Hard Physical Vapor Deposited (PVD) Coatings Harri Lille1,a*, Alexander Ryabchikov1,b, Jakub Kõo1,c, Valdek Mikli2,d, Eron Adoberg2,e, Heinar Vagiström2,f, Jakob Kübarsepp2,g, Priidu Peetsalu2,h 1Institute of Forestry and Rural Engineering, Estonian University of Life Sciences, Kreutzwaldi 5, 51006 Tartu, Estonia 2Department of Mechanical and Industrial Engineering, Tallinn University of Technology, Ehitajate tee 5, 19086 Tallinn, Estonia aharri.lille@emu.ee, balexander.ryabchikov@emu.ee, cjakub.koo@emu.ee, dvaldek.mikli@taltech.ee, eeron.adoberg@taltech.ee, fheinar.vagistrom@taltech.ee, gjakob.kubarsepp@taltech.ee, hpriidu.peetsalu@taltech.ee Keywords: AlCrN, TiAlN, TiCN, PVD, Residual Stresses, Tube Length Variation, Curvature Method.
Acknowledgements This study was supported by the Estonian Ministry of Education and Research through the Institutional Research Funding IUT 19-29 „Multi-scale structured ceramic-based composites for extreme applications“, IUT 19-28 “New materials and technologies for solar energetics”, TAR 16016 (TK141) “Advanced materials and high-technology devices for sustainable energetics, sensorics and nanoelectronics”.
Forum. 681 (2011) 165-170
Forum. 681 (2011) 455-460. https://doi.org/10.4028/www.scientific.net/MSF.681.455 [11] M.

Badlishah Ahmad1,b and Ali Amer Ahmed1,c 1School of Computer and Communication Engineering, Universiti Malaysia Perlis, Malaysia ayhky73taae@yahoo.com, bbadi@unimap.edu.my, cali_alrawi2003@yahoo.com Keywords: GPS, Hardware, Software, PDA, Bread crumb, GSM.
Electric vehicles is a perfect transportation systems to move people inside the sustainable city, The most advanced GPS / GPRS hardware designed for tracking solution u-blox all-in-one GPS receiver for high sensitivity , fastest connectivity (hot start: < 1.2 sec, warm start: < 30sec) and most accurate positioning (SBAS: 2m) will be used.
Scharnhorst, "Using truck probe GPS data to identify and rank roadway bottlenecks," Journal of Transportation Engineering, vol. 139, pp. 1-7, 2012
Žagar, "GPS Tracking of Self-balancing Vehicle for Extreme Environment based on AndroidOS," in 20th Telecommunications Forum TELFOR 2012, 2012
Perugu, "An innovative method using GPS tracking, WINS technologies for border security and tracking of vehicles," in Recent Advances in Space Technology Services and Climate Change (RSTSCC), 2010, 2010, pp. 130-133

Any slight variation is certain to cause performance change of the complete machine, so besides manufacturing effect, engineering verification is a key step to ensure the satisfaction of a design schema.
Engineering verification.
Forum Vol. 697-698 (2011), p.785
Ierapepritou: Industrial & Engineering Chemistry Research Vol. 48(18) (2009),p. 8566
Adithan: International Journal of Advanced Manufacturing Technology Vol. 42(1-2)(2009), p. 13

Microstructure Change of B2 Precipitates in an Fe-Al-Ni Alloy Due to Two-Step Heat-Treatment Junji Yamanaka 1, a, Chiaya Yamamoto 2, b, Yasuhiro Kuno 3, Minoru Doi 4, c 1: Center for Crystal Science and Technology, University of Yamanashi, 7-32 Miyamae-cho, Kofu-city, Yamanashi Prefecture 400-8511, JAPAN 2: Center for Creative Technology, University of Yamanashi, 4-3-11 Takeda, Kofu-city, Yamanashi Prefecture 400-8511, JAPAN 3: Department of Materials Science and Engineering, Nagoya Institute of Technology, Gokiso-cho, Showa-ku, Nagoya 466-8555, Japan (Graduate Student) 4: Department of Mechanical Engineering, Aichi Institute of Technology, 1247 Yachigusa, Yakusa-cho, Toyota 470-0392, Japan ajyamanak@yamanashi.ac.jp, bchiayay@yamanashi.ac.jp, cmdoi@aitech.ac.jp Keywords: phase transformation, phase separation, B2 ordered phase, precipitate morphology, scanning transmission electron microscopy Abstract We have been studying the microstructure change of B2 cubic precipitates
Conf. on Advanced Materials and Processing (PRICM4), edited by S.
Forum Vol. 638-642 (2010), p. 2274
Forum Vol. 638-642 (2010), p. 2215.

Zhang 2,b 1 School of Mechanical and Electric Engineering, Zhongyuan University of technology 2 College of Information & Business, Zhongyuan University of technology Zhengzhou, 450007, P.R.
Introduction Fine-blanking technology is an advanced sheet metal processing technology.
Wierzbicki: Journal of Engineering Materials and Technology Vol. 126 (2004), p. 314 [5] H.
Ding: Materials Science Forum Vol.575-578 (2009), p.316 [6] J.H.
Fan, Z.M.Zhang: Materials Science Forum Vol. 628-629 (2009) p.541

Advanced techniques to measure FEA- and design-relevant properties such as local and effective Young’s modulus and effective CTE values were developed and described in this paper.
Introduction The reliability-limiting effects in 3D IC structures using Through-Silicon Vias (TSVs) including mechanical stress distributions and the resulting effects on material integrity (e.g. failure modes like interface delamination, cohesive cracking, metallurgical degradation at joints, and chip-package interaction) and finally on device performance degradation are challenges in advanced 3D integration technologies and product development [1].
Managing internal mechanical stress is a key task to ensure the requested reliability of products manufactured in advanced CMOS technology nodes, and it is a highly ranked concern for 3D TSV technologies [2].
Based on the results the simulation engineer has to find the balance between computing time and resolution in respect to the anisotropic effect of the Cu line direction dominance.
Zschech, Forum Bildverarbeitung 327 – 334 (2012)