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The possibility of anodic oxidation of SiC surfaces by a strong, local electric field applied during Atomic Force Microscopy (AFM) under ambient conditions is an interesting method to achieve nano-patterning of SiC, but is also a side-effect to be well characterized and controlled during this kind of AFM measurements if used to determine the local electric properties.
Based on Atomic Force Microscopy (AFM), several modes are becoming essential techniques to probe local electrical properties.
The force curves show that the adhesion force, between the AFM tip and the SiC surface, increases of a factor of 1.5 when a voltage of -10 V is applied to the tip.
The electric field is around 8.2 x 109 V/m at the contact point and it is divided by a factor 10 at 20 nm away from the contact point.
The topography in the area of the contact source is due to the different mechanical properties of the materials (SiC, oxide and metals).

reagents content (g/L) process parameters Values CuSO4·5H2O 220 g/L ZrO2 dosage 10,20,30,40,70(g/L) H3BO3 40 g/L average current density 2,4,6,8,10(A/dm2) H2SO4 60g/L duty cycle 0.2,0.4,0.6,0.8 C12H25SO3Na 0.05g/L pulse frequency 100,300,700,1100,2000(Hz) The reagents used in experiments are AR, deionized water is used to configure the electroforming solution for reducing the influence of the impurity factors.
And as shown in Fig.8, the images of Cu-ZrO2 alloy deposits were affected significantly by frequency.
Corresponding author: Li Zhiyong, School of Mechanical Engineering, Shandong University of Technology.
Guo, et al., Microstructure and properties of N-i Co/nano-Al2O3 composite coatings by pulse reversal current electrodeposition, Applied Surface Science, 253(2006): 2132-2137
Branger, Effects of ultrasonic irradiation on the properties of coatings obtained by electroless plating and electro plating, Ultrasonics Sonochemistry. 12(2004)(1-2): 9- 13.

However, solid propellants are prone to aging during long-term storage, affecting their mechanical properties and combustion properties, resulting in a decline in weapon performance, and a huge loss of combat effectiveness[1].
The aging characteristics of solid propellants include: appearance changes, physical and chemical property changes, mechanical property changes, electrical properties changes and changes in the interfacial bonding strength of the column/lining layer (insulation layer), usually The more significant changes are the changes in the mechanical properties, interfacial bonding properties and electrical properties of the solid propellant.
Study on aging properties of HTPB solid propellant[D].
Main curve of tensile mechanical properties and strength of heat-aging modified bibase propellant[J].
Properties and principles of solid propellant[M].

Yao College of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, 200030, China Keywords: Indexable inserts, 3-D chip breaker, Model and design Abstract.
The quality of the breaking chip will affect both the machining quality and the efficiency in cutting metal for the numerical controlled machine (NC), the machining center (MC), the flexible manufacturing system (FMS), and many sorts of automatic machines and automatic product lines.
The properties of three kinds of carbide indexable turning inserts were discovered by cutting test.
According to this basic thinking, we can build the designing model equation for 3-D chip breaker: F=B+ S. (1) In equation, F: 3-D chip breaker; B: basic model; S: form factor.
Designing the form factor, and make sure of parameters of W� Wn, h, ro, � (Fig.5). 3.

In order to increase the generated electricity from TENGs, the properties of these electrodes should be modified.
These include electrical and mechanical properties such as electrical conductivity, flexibility, natural frequency, and the surface shape parameters [2, 29-31].
Also, the electrical properties, including electrical conductivity, are greatly affected by the temperature of the environment.
Hegab, AC conductivity and dielectric properties of Sb2Te3 thin films, Vacuum 80 (2005) 284-294
Al-Solami, Heat-treatment effect on the structural and optical properties of flash evaporated Sb2Te3 thin films, Eur.

By the comparative analysis of the results from above two models, the numerical simulation model was improved and on this basis, some factors such as Young modulus E, confining pressure and initial stress of grout and medium and the anchorage length and so on, affecting the distribution and diffusion of shear stress for two interfaces of anchorage type structures were discussed.
Contact pair whose major parameters coming from laboratory test was adopted for simulating the mechanical behavior of shear stress on two interfaces.
At the same time, the Fig.14 shown the diffusion law of linear property of bond stress along the radial direction (far from the pull-out zone).

The seismic performance of reinforced concrete(RC) columns is one of the controlling factors of the shock resistance for RC frame structures and bridges under seismic loads.
Due to the complicated material behavior and complex external force during the earthquake, an accurate simulation of the mechanical performance under seismic loads demands more precisions for the hysteresis constitutive laws of materials.
Introduction Reinforced concrete (RC) columns, which are the important supporting member of bridges and reinforced concrete frame structures, will be repeatedly affected under the horizontal seismic forces of earthquake excitation.
In severe cases,the structure could lose its functions, or even collapse,and cause heavy losses of lives and property.

Introduction Tolerance & fit directly affects the product manufacturing and cost, which controls the dimensional accuracy of mechanical parts, ensures the production enterprise collaboration, product quality and parts exchange.
When designers use AutoCAD for mechanical design, they have to find information from mechanical design manual or to determine on their experiences because each version of AutoCAD can not seek tolerance, and tolerances are different for different sizes and tolerance grades, and have many labeling forms.
Basic dimensions can be input by a text box, or by the AcadEntity annotation object properties measurement to return the size of the measured value, tolerance grades and basic deviations are selected with the list box.
The property values are "acTolNone" (no tolerance), "acTolSymmetrical" (symmetric tolerance), "acTolDeviation" (limit deviation), "acTolLimits" (limit size), "acTolBasic" (basic size).
"ToleranceHeightScale" gets or sets the scale factor of the height of the text for the tolerance values relative to the object's general text height.

So super martensitic stainless steel 00Cr13Ni5Mo2 is developed and used successfully as down-hole string [3], originating from the satisfactory combination of excellent mechanical properties, availability at a low cost and high corrosion resistance [4].
As is well-known, the stability of the passive films is dependent mainly on the potential of the materials, and the pitting resistance of the materials is related directly to the nature of the passive films, which are affected by many factors.
Uhlig, Environmental factors affecting the critical potential for pitting in 18-8 stainless steel, J.

Introduction In semiconductor and display manufacturing process, particles with various sizes, components and shapes are generated by many kinds of factors.
When the particles are deposited on the wafer surface and not be controlled properly, it will adversely affect manufacturing process and cause yield drop.
Especially, as development of technique leads to line width and pitch size reduction of semiconductor, particles having diameter around tens of nanometer to several nanometers, which have not been identified as the cause of defects, also act as failure factor.
Specifically, wafer with known properties like particle size distribution or shape and size of deposited area.
The flow rate and distance between nozzle and wafer, and strength of electric field can be controlled and it will affect the particle deposition result such as number of deposited particle or size of deposition area.