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Abou El-khair Composite Materials Lab.
Figure 1a shows the peaks for Al and Si element content, while Figure 1b shows that the composite consists of ZrO2 ceramic and Al-Si.
Al-Si Al-Si Al-Si Al-Si Al-Si Al-Si Al-Si Al-Si Al-Si Al-Si ZrO2 ZrO2 ZrO2 Al-Si 2qo a) b) Figure 1 X-ray diffraction patterns of: (a) A357 alloy and (b) A357/10vol.
Abou El-khair, Microstructure characterization and tensile properties of squeeze- cast AlSiMg alloys, Materials Letters, 59 (2005) 894-900. [12] M.
Abou El-khair and A.

Beschoten, et.al.: Nature Vol.402, (1999), p.790
Johnston-Halperin, et.al.: Semic.
Gregg, et.al.: J.
Magno, et.al.: Appl.
Baidus’, et.al.: J. of Surface Investigation.

El-Sehiemy1, *, Adel A.
Abou EL Ela2 and A.
Abou El Ela et al [24] solved the optimal active power dispatch problem using MFLP technique involving preventive action constraints.
Abou EL-Ela, M.
El-Ela, A.

Experimental methods An AZX311 alloy extrusion sheet with an initial thickness of 3 mm and chemical composition of 3.5% Al, 0.88% Zn, 1.32% Ca, 0.35% Mn, 0.006% Si, 0.001% Cu, <0.001% Ni, <0.001% Fe, and bal.
Results of the tensile yield strength test, the Y.S., U.T.S., and El., are also shown.
Annealing at a temperature of 423 K slightly decreased the Y.S. and U.T.S. values, but El. increased to 10% from the 5% El. of the as-rolled alloy.
After annealing for 100 h, the Y.S. and El. were 300 MPa and 7%, respectively.
Fig. 5 Tensile Y.S., U.T.S., El., and α-Mg phase grain size for each annealing temperature.

Sun et al., [9] found that small amount of Al addition enabled single-phase Ti3SiC2 synthesis and the optimal sintering temperature for the Ti3SiC2 synthesis is greatly decreased by the Al addition.
However, when more Al was added (x=0.3), the purity of Ti3SiC2 began to decrease and wt. % of TiC and Ti5Si3 started to increase in XRD analysis, suggesting that excessive Al would lower the Ti3SiC2 purity as reported by Jin et al., [10] in their study on the effect of Al addition on phase purity of Ti3Si(Al)C2 synthesized by mechanical alloying.
In fact this phenomenon had been stated and explained by the mechanism proposed by El-Raghy and Barsoum [1], in which during the last stage of the sintering process, Ti3SiC2 may continue to react with C to form TiC.
El-Raghy: J.
El-Raghy: J.

The multilayer yellow-green organic light-emitting devices (OLED) ITO/NPB/TSPAPB/BCP/TPBi or Alq3/LiF/Al were fabricated.
EL properties.
Their EL performances were summarized in Tab. 1.
b. λem: Center wavelength of the EL spectra.
Four non-dopant yellow devices ITO/NPB/TSPAPB/BCP/TPBi or Alq3/LiF/Al were fabricated.

Fig.1 Chemical structure of TPAHQZn Fig.2 Normalized EL spectra of devices 1 and 2 at V=13V Experiment Organic light-emitting device 1 were fabricated, using yellow-light emission material TPAHQZn as a HTL and emitter, the device 1 structure was : ITO/2T-NATA (17 nm)/ TPAHQZn (40 nm)/ NPBX (25 nm)/ Alq3 (30 nm)/LiF (0.5nm)/Al .
Results and discussion The normalized EL spectra of devices 1 and 2 at V=13V are shown in Figure 2.
The broad EL spectra in different voltages cover the whole visible range from 380 to 780 nm.
Lett., Vol. 69(15)(1996), p.:2160  [7] Elschner A, Bruder f, Heuer H W, et al.
Nature, Vol. 403(2000), p. 750 [12] Yingfang Zhang, Gang Cheng, Yi Zhao, et al.

El Hadi1,g, A.
El Moussaouy1,3,h, C.M.
Kerkour El-Miad2,k, F.
El Hadi, A.
El Hadi, R.

Refer to the Fig.1, in order to measure the electroluminescence intensity; a diode structure of Au/PSiNs/P-Si/Al was used.
Metal electrode which is aluminum (Al) was coated on the bottom surface of silicon wafer.
P-type silicon wafer Metal electrode (Al) Fig. 1.
A diode structure of Au/PSiNs/P-Si/Al.
A diode structure of Au/PSiNs/P-Si/Al was used to measure the EL spectra of the samples.

The 20 joints respectively are Head (H), ShoulderCenter (SC), ShoulderLeft (SL), ShoulderRight (SR), ElbowLeft (EL), ElbowRight (ER), WristLeft (WL), WristRight (WR), HandLeft (HL), HandRight (HR), Spine (S), HipCenter (HipC), HipLeft (HipL), HipRight (HipR), KneeLeft (KL), KneeRight (KR), AnkleLeft (AL), AnkleRight (AR), FootLeft (FL), and FootRight (FR).
Table 1 The relationship between 20 key points Distance(X axis) Distance(Y axis) Distance(Z axis) Angle Upper body HL to HR HL to EL HL to SL HR to WR HR to ER HR to SR HL to HR HL to EL HL to SL HR to WR HR to ER HR to SR HL to HR HL to EL HL to SL HR to WR HR to ER HR to SR {HL,SL,SC} {HR,SR,SC} {HL,S,HR} {WL,EL,SL} {WR,ER,SR} {H,SC,SL} {H,SC,SR} Lower body HipL to KL HipL to AL HipR to KR HipR to AR HipL to KL HipL to AL HipR to KR HipR to AR HipL to KL HipL to AL HipR to KR HipR to AR {AR,KR,HipC} {AL,KL,HipC} {AL,HipC,AR} {AL,HipL,HipC} {AL,HipR,HipC} Whole body HL to AL EL to KL HR to AR ER to KR HL to AL EL to KL HR to AR ER to KR HL to AL EL to KL HR to AR ER to KR {H,SC,KL} {H,SC,KR} {EL,HipC,KL} {ER,HipC,KR} For example, in order to show the distance between left hand and right hand in the three-dimensional space, assuming that A(x1, y1, z1) as the coordinate of left hand, B(x2, y2, z2) as the coordinate of right
-J., et al.
[5] Ravi N., Dandekar N., and Mysore P., et al.
Yi et al.