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Online since: August 2014
Authors: Mohd Arif Anuar Mohd Salleh, Norainiza Saud, Flora Somidin
IEEE 10th Electronics Packaging Technology Conference 2008:669-674
[7] Gupta M, Wong WLE.
Online since: January 2015
Authors: Volodymyr I. Korsun, Artem Korsun, Sergey Mashtaler
., Wong, Y.L., Poon, C.S., Tang, C.A.
Vliyaniye povyshennykh temperatur na prochnost i deformatsii vysokoprochnykh modifitsirovannykh betonov [The influence of elevated temperatures on the strength and strain of high-modified concrete] (2008) Sbornik dokladov mezhdunarodnoy nauchno-prakticheskoy konferentsii studentov, pp. 142-146
Online since: December 2009
Authors: Yan He, Lian Xiang Ma, Zhong Yin, Jun Ping Song
Vol. 7(2001), p.199 [10] S.Luo and C.P.Wong: IEEE Trans Compon Pack Technol Vol. 23(2000), p.151
[11] W.Y.Zhou, C.F.Wang, and Q.L.An: Journal of Composite Materials Vol. 42 (2008), p. 173 [12] R.S.Prasher: Journal of Heat Transfer Vol. 123(2001),p. 969
Online since: September 2013
Authors: Hui Li, Xiao Ting Li, Shou Zhi Pu
Wong, N.Y.
Vol. 194(2008), p. 333 [14] K.
Online since: February 2012
Authors: Fei Hui, Xiao Le Wang, Xin Shi
Tixier, "Results of the MITRA project: Monitoring and intervention for the transportation of dangerous goods", Journal of Hazardous Materials, Vol.152, No.4,pp.516–526, 2008
E.Wong, "System Design of Smart Card Application for Tank Truck Conveying Management".
Online since: January 2012
Authors: Chen Wang
., Wong, D.S., Li, J., Zhao, Y.: Generic transformation from weakly to strongly unforgeable signatures.
Technol. 23(2), 240–252 (2008) [10] Park, H., Lim, S., Yie, I., Kim, K., Song, J.: Strong unforgeability in group signature schemes.
Online since: February 2016
Authors: Ilmira Suleymanova, Aleksey Shlyapugin, Yaroslav A. Erisov
Materials & Design, 2008, 29(2): 526-532
(in Russian) [8] Choudhury I.A., Lai O.H., Wong L.T.
Online since: December 2023
Authors: Mohamed Abdel Hady Gepreel, Sengo Kobayashi, Wael Khair-Eldeen, Nour Mahmoud Eldabah, Amin Shoukry
Wong, H.
Morinaga, Materials Science and Engineering: A 480 (2008) 167-174
Online since: July 2013
Authors: Zhe Nan Tang, Xiu Yun Du
Wong, S.K.
Balasubramanian, et al, A study of thermo-mechanical stress and its impact on through-silicon vias, Journal of Micromechanics and Micro engineering. 18 (2008) 075018-075031
Online since: May 2011
Authors: W. S. Ou, J. M Chang, Y.D. Kuan, Wen Pei Sung
[8] N.H.Wong, Y.
Fang, Energy and Buildings, 40, 1048-1052 (2008).
Showing 1941 to 1950 of 3243 items