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Thus sericite/TiO2 composites materials are very efficient replacement of white titanium powder.
Nicole, et al.: Chemistry of Materials 22 (2010) 4406-4413 [5] M.
Nemati, et al.: International Journal of Environmental Science and Technology 8 (2011) 545-552 [12] X.D.
Marcaide, et al.: Solar Energy Materials and Solar Cells 94 (2010) 1081-1088 [14] R.
Wang, et al.: Materials Chemistry and Physics 103 (2007) 230-234

Anti-percolation of concrete materials is a very important technical indicator.
The anti-percolation of polymer materials increases with the increase of the density.
Polymer Materials Science and Engineering, 1995(02):86-91, in Chinese [3] Katsuhisa Yamashita,Chisato Nonomura.
Journal of Cellular Plastics, 2004.40(6):481-488
[4] O.Buzzi, S.Ftyus, Y.Sasaki. mechanics of materials, 2008(40)1012-1021

Study on Compatibility of Modified the Cement-based Composite Biomass Materials by Agent Jun Liu1,a, Chao Lin 2,b , Wenhui Sun1,cand Xuming Wang3,d 1School of Materials Science and Engineering, Shenyang Jianzhu University, Shenyang 110168, China 2Himin Solar Co., Ltd, ShanDong 253000, China 3School of Management, Shenyang Jianzhu University, ShenYang 110168, China aliujun2699@126.com, bLinc650224@163.com, cswhno.1md001@163.com, dwangxumingfan@163.com Keywords:Compatibility;The cement-based composite biomass materials;Agent(key words) Abstract.
So people found the biomass materials and the biomass materials technologies were developed rapidly.
Tu: NEW BUILDING MATERIALS.
[3] W.W and R.C.et al: Forest Products Journal.
[4] Hachmi M, Moslemi A.A, et al,: Wood Science and Technology.

Abstract: With low-k dielectric materials taking the place of oxide dielectrics as the primary dielectric materials, the low-k dielectric materials and interconnection Cu metals during Chemical Mechanical Planarization (CMP) is becoming a critical surface quality issue as well.
However, the mechanical strength of porous low-k dielectric materials is worse than that of dense materials.
Chang’s paper which published in Thin Solid Films [4], alkaline slurry is harmful for low-k dielectric materials, for example, its k value obviously increase and Cu2+ can involve in porous low-k dielectric materials and lead to further pollution.
Acknowledgment This work was financially supported by the National Significant Science and Technology Special Projects, China (2009ZX02308).
Journal of Hebei University of Technology, 2009, 38(2): 1-8 [2] Yair Ein-Eli, David Starosvetsky.

Beijing, China Building Materials Industry Press.(1998)218-219
Journal of Inorganic Materials.6(2003) 1205-1209
Materials Science & Engineering.5(2009) 804-808
Food Science.8(2002)77-80
Materials Review.1(2006)84-86.

Thermally Stable Encapsulation Material Based on Green and Red Lanthanide Phosphor for White Light Emitting Diodes Wedianti Shualdi*, Nik Mohd Azmi Nik Abd Aziz, Nurul Huda Yusoff, Nor Adhila Muhammad, Khairuldin Mohd Isha Energy Materials Section, Advanced Materials Research Center (AMREC), Standards and Industrial Research Institute Malaysia (SIRIM) Berhad, Lot 34, Jalan Hi-Tech 2/3, Kulim Hi-Tech Park, 09000 Kulim, Kedah, Malaysia Email: wedianti@sirim.my Keywords: white LED, phosphor material, lanthanide based complex Abstract This study reported thermal stability of hybrid sol-gel encapsulation materials doped with lanthanides complexes for generating white light.  
At T=350oC, the weight loss of samples are very significant due to decomposition of organic materials in VTES:TEOS sol-gel matrices.
Acknowledgment This work was supported by the Ministry of Science, Technology and Innovation (MOSTI), Malaysia with grant file No. 03-03-02-SF0279.
Bril, “Energy Transfer fron Ce3+ to Tb3+ in Scandium Borate”, Journal of Luminescence, Vol 3, Issue 1 (1970) 18-20 [5] L.
[7] Seung-Yeon Kwak, Na Ree Kim and Byeong-Soo Bae, “Dye-Bridged Hybrid Materials for Robust and High-Performance Wavelength Converter of White LEDs”, SID Symposium Digest of Technical Papers, Volume 43, Issue 1, (2012) 1314–1317

The hardness of the obtained materials decreased, probably due to some loosening of the structure of the polymer matrix.
Liang, Facile strategy and mechanism of greatly toughening epoxy resin using polyethersulfone through controlling phase separation with microwave assisted thermal curing technique, Journal of Applied Polymer Science. 137 (2020) 48394
Guo, A low loading of grafted thermoplastic polystyrene strengthens and toughens transparent epoxy composites, Journal of Materials Chemistry C. 5 (2017) 4275-4285
Chen, Fabrication of a highly tough, strong, and stiff carbon nanotube/epoxy conductive composite with an ultralow percolation threshold via self-assembly, Journal of Materials Chemistry A. 7 (2019) 15731-15740
Journal of Molecular Liquids, Vol. 253 (2018), 340-346.

S : Materials Science and Engineering: R: Reports (2012)
X : Journal of Materials Chemistry A (2013)
[12] Mi, Y,Hu, W,Dan, Y and Liu, Y : Materials Letters Vol. 62 (2008), p. 1194
[15] Zhang, M,Chen, Q,Xi, Z,Hou, Y and Chen, Q : Journal of Materials Science Vol. 47 (2012), p.2328
Z : Advanced Materials Research Vol. 335 (2011), p.1364

Introduction With the continuous progress of science and technology，advanced Materials has become the focus of global strategy development.
Because of many disadvantages of thermosetting resin-based composite materials,people began to Toughening the material.
As a excellent intensifier, carbon fibre can smartly enhance intensity of materials.
However, composites can’t absorb bounce energy like mental materials.
[15] Xiaosu Yi, Yahong Xu,Tang Bangmin , Journal of Materials Engineering( in Chinese), 2004(9):3-8.

The results allow us to choose the geometrical parameters ​​for milling cutter, apart from the working parameters for processing the surface of wood materials with the highest quality as possible.
The processed materials are tropical woods, churasia and canarium, with dimensions as follows: length of wood samples lw = 1000mm, width b = 20 ... 22mm.
Conclusions In the paper having theoretical and experimental researches on the chip formation and surface shaping of churasia and canarium wood materials while milling, the cutting tool material is carbide WCCO6.
Journal 1968, 5, 118-121p
International Journal Adv, Manuf.