Sort by:
Publication Type:
Open access:
Publication Date:
Periodicals:
Search results
Online since: December 2024
Authors: Tian Hong Gu, Shu Wei Jiang, Wen Su
Tensile Properties, Strain Rate Sensitivity and Microstructural Analysis of SN100C Solder Alloys
Tianhong Gu1,a, Shuwei Jiang1,b, Wen Su1,c
1Advanced Materials Research Centre (AMRC) and Department of Civil Engineering, Design School, Xi’an Jiaotong-Liverpool University, Suzhou, Jiangsu, 215123, China.
References [1] Cheng S, Huang C-M, Pecht M 2017 Microelectronics Reliability 75 77 [2] Nogita K, Greaves M C, Guymer B D, Walsh B B, Kennedy J M, Duke M D, Nishimura T 2010 Transactions of The Japan Institute of Electronics Packaging 3 104 [3] Lin Y-W, Lin K-L 2013 Intermetallics 32 6 [4] Moon K-W, Boettinger W J, Kattner U R, Biancaniello F S, Handwerker C 2000 Journal of electronic materials 29 1122 [5] Yokoi M, Kobayashi T, Shohji I Materials Science Forum p2081-2086 [6] Schwartz M 2014 Soldering: Understanding the basics (ASM International) [7] Lai Y-S, Song J-M, Chang H-C, Chiu Y-T 2008 Journal of Electronic Materials 37 201 [8] Hidaka N, Watanabe H, Yoshiba M 2009 Journal of electronic materials 38 670 [9] Hasnine M, Vahora N 2018 Journal of Materials Science: Materials in Electronics 29 8904 [10] Yang T 2007 Master's thesis, Harbin University of Science and Technology
[11] Azman D I N A, Osman S A, Narayanan P, Kozutsumi Y 2024 Journal of Advanced Research in Micro and Nano Engineering 17 69 [12] Yi J, Zhang Y, Xu L, Liu S, Yang Y 2017 Electronic Components and Materials 31(3) 49-52
[13] Yahaya M Z, Mohamad A A 2017 Soldering & Surface Mount Technology 29 203 [14] Pang J H L 2011 Lead Free Solder (Springer) [15] Kim J-W, Kim D-G, Jung S-B 2005 Metals and Materials International 11 121 [16] Tada N, Nishihara R, Masago H 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) p145-148 [17] Jang W-L, Wang T-S, Lai Y-F, Lin K-L, Lai Y-S 2012 Microelectronics Reliability 52 1428 [18] Nogita K, Salleh M A M, Smith S, Wu Y, McDonald S D, Razak A G A, Liu S, Akaiwa T, Nishimura T 2017 Transactions of The Japan Institute of Electronics Packaging 10 E17 [19] Izwan Ramli M I, Saud N, Mohd Salleh M A A, Derman M N, Said R M, Nasir N 2015 Applied Mechanics and Materials 754 513 [20] Izwan Ramli M I, Saud N, Mohd Salleh M A A, Derman M N, Said R M, Nasir N Materials Science Forum p161-166 [21] Johansson J, Belov I, Johnson E, Dudek R, Leisner P 2014 Microelectronics Reliability 54 2523 [22] George.E., Das.D., Osterman.M.,
Pecht.M. 2011 Transcations on Device and Materials Reliability 11 328 [23] Kanlayasiri K, Kongchayasukawat R 2018 Transactions of Nonferrous Metals Society of China 28 1166 [24] Ma H, Suhling J C J J o m s 2009 44 1141 [25] Abtew M, Selvaduray G 2000 Materials Science and Engineering: R: Reports 27 95 [26] Bai N, Chen X, Fang Z 2008 Journal of electronic materials 37 1012 [27] Xu Y, Gu T, Xian J, Giuliani F, Britton T B, Gourlay C M, Dunne F P 2022 Materials Science and Engineering: A 855 143876 [28] Shohji I, Yoshida T, Takahashi T, Hioki S 2004 Materials Science and Engineering: A 366 50 [29] El-Taher A, Abd Elmoniem H, Mosaad S 2023 Journal of Materials Science: Materials in Electronics 34 590 [30] Zhu F, Zhang H, Guan R, Liu S, Yang Y 2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits p239-243
References [1] Cheng S, Huang C-M, Pecht M 2017 Microelectronics Reliability 75 77 [2] Nogita K, Greaves M C, Guymer B D, Walsh B B, Kennedy J M, Duke M D, Nishimura T 2010 Transactions of The Japan Institute of Electronics Packaging 3 104 [3] Lin Y-W, Lin K-L 2013 Intermetallics 32 6 [4] Moon K-W, Boettinger W J, Kattner U R, Biancaniello F S, Handwerker C 2000 Journal of electronic materials 29 1122 [5] Yokoi M, Kobayashi T, Shohji I Materials Science Forum p2081-2086 [6] Schwartz M 2014 Soldering: Understanding the basics (ASM International) [7] Lai Y-S, Song J-M, Chang H-C, Chiu Y-T 2008 Journal of Electronic Materials 37 201 [8] Hidaka N, Watanabe H, Yoshiba M 2009 Journal of electronic materials 38 670 [9] Hasnine M, Vahora N 2018 Journal of Materials Science: Materials in Electronics 29 8904 [10] Yang T 2007 Master's thesis, Harbin University of Science and Technology
[11] Azman D I N A, Osman S A, Narayanan P, Kozutsumi Y 2024 Journal of Advanced Research in Micro and Nano Engineering 17 69 [12] Yi J, Zhang Y, Xu L, Liu S, Yang Y 2017 Electronic Components and Materials 31(3) 49-52
[13] Yahaya M Z, Mohamad A A 2017 Soldering & Surface Mount Technology 29 203 [14] Pang J H L 2011 Lead Free Solder (Springer) [15] Kim J-W, Kim D-G, Jung S-B 2005 Metals and Materials International 11 121 [16] Tada N, Nishihara R, Masago H 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) p145-148 [17] Jang W-L, Wang T-S, Lai Y-F, Lin K-L, Lai Y-S 2012 Microelectronics Reliability 52 1428 [18] Nogita K, Salleh M A M, Smith S, Wu Y, McDonald S D, Razak A G A, Liu S, Akaiwa T, Nishimura T 2017 Transactions of The Japan Institute of Electronics Packaging 10 E17 [19] Izwan Ramli M I, Saud N, Mohd Salleh M A A, Derman M N, Said R M, Nasir N 2015 Applied Mechanics and Materials 754 513 [20] Izwan Ramli M I, Saud N, Mohd Salleh M A A, Derman M N, Said R M, Nasir N Materials Science Forum p161-166 [21] Johansson J, Belov I, Johnson E, Dudek R, Leisner P 2014 Microelectronics Reliability 54 2523 [22] George.E., Das.D., Osterman.M.,
Pecht.M. 2011 Transcations on Device and Materials Reliability 11 328 [23] Kanlayasiri K, Kongchayasukawat R 2018 Transactions of Nonferrous Metals Society of China 28 1166 [24] Ma H, Suhling J C J J o m s 2009 44 1141 [25] Abtew M, Selvaduray G 2000 Materials Science and Engineering: R: Reports 27 95 [26] Bai N, Chen X, Fang Z 2008 Journal of electronic materials 37 1012 [27] Xu Y, Gu T, Xian J, Giuliani F, Britton T B, Gourlay C M, Dunne F P 2022 Materials Science and Engineering: A 855 143876 [28] Shohji I, Yoshida T, Takahashi T, Hioki S 2004 Materials Science and Engineering: A 366 50 [29] El-Taher A, Abd Elmoniem H, Mosaad S 2023 Journal of Materials Science: Materials in Electronics 34 590 [30] Zhu F, Zhang H, Guan R, Liu S, Yang Y 2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits p239-243
Online since: August 2014
Authors: Eng Juraj Králik
Krejsa, Measured Data Processing in Civil Structure Using the DOProC, Method, Advanced Materials Research. 859 (2013) 114-121
[7] IAEA Safety Standards, Advanced Nuclear Plant Design Options to Scope with External Events, IAEA-TECDOC-1487, Vienna, February, 2006
First European Conference on Earthquake Engineering and Seismology, 3-8 September, Geneva, Switzerland, pp 422, 2006
Kabeláč, Study of a Nuclear Power Plant Containment Damage Caused by Impact of a Plane, International Refereed Journal of Engineering and Science (IRJES). 1 4 (2012) 48-53
Sugano, Local Damage to Reinforced Concrete Structures Caused by Aircraft Engine Missiles: Part 2, Evaluation of Test Results, Nuclear Engineering and Design, Vol. 140, 1993, pp. 407-423
[7] IAEA Safety Standards, Advanced Nuclear Plant Design Options to Scope with External Events, IAEA-TECDOC-1487, Vienna, February, 2006
First European Conference on Earthquake Engineering and Seismology, 3-8 September, Geneva, Switzerland, pp 422, 2006
Kabeláč, Study of a Nuclear Power Plant Containment Damage Caused by Impact of a Plane, International Refereed Journal of Engineering and Science (IRJES). 1 4 (2012) 48-53
Sugano, Local Damage to Reinforced Concrete Structures Caused by Aircraft Engine Missiles: Part 2, Evaluation of Test Results, Nuclear Engineering and Design, Vol. 140, 1993, pp. 407-423
Online since: March 2014
Authors: Deng Yu Li, Jun Xiao, Xiao Xu Leng
The reconstruction results can be used in engineering calculation.
As a special object, rock mass is difficult to measure and reconstruct but important for engineering calculation.
Wei: Point Cloud Data Acquisition Based on Reverse Engineering Technology.
Computer Graphics Forum, Vol. 26(2) (2007), p. 214-226
The 2013 2nd International Conference on Computer, Mechatronics, Control and Electronic Engineering.
As a special object, rock mass is difficult to measure and reconstruct but important for engineering calculation.
Wei: Point Cloud Data Acquisition Based on Reverse Engineering Technology.
Computer Graphics Forum, Vol. 26(2) (2007), p. 214-226
The 2013 2nd International Conference on Computer, Mechatronics, Control and Electronic Engineering.
Online since: August 2008
Authors: Bussarin Ksapabutr, M. Panapoy
Ksapabutr
b
Department of Materials Science and Engineering, Faculty of Engineering and Industrial
Technology, Silpakorn University, Nakhon Pathom 73000, Thailand
a mpanapoy@hotmail.com, b kbussarin@hotmail.com
Keywords: Zirconia, Oxide One-Pot Synthesis, Zirconatrane, Sol-Gel Process, Electrospinning,
Nanofibers
Abstract.
Introduction Zirconia materials have attracted a great deal of attention for a wide range of applications, e.g., catalysis, automotive gas sensor, advanced ceramics and fuel cell [1].
The crystalline phase of calcined fibers was identified by a Bruker D8 Advance diffractometer using Cu Kα radiation (λ = 0.154 nm).
Acknowledgment This work was supported by Department of Materials Science and Engineering, Faculty of Engineering and Industrial Technology, Silpakorn University and the National Excellence Center for Petroleum, Petrochemicals, and Advanced Materials.
Forum Vol. 480-481 (2005), p. 549
Introduction Zirconia materials have attracted a great deal of attention for a wide range of applications, e.g., catalysis, automotive gas sensor, advanced ceramics and fuel cell [1].
The crystalline phase of calcined fibers was identified by a Bruker D8 Advance diffractometer using Cu Kα radiation (λ = 0.154 nm).
Acknowledgment This work was supported by Department of Materials Science and Engineering, Faculty of Engineering and Industrial Technology, Silpakorn University and the National Excellence Center for Petroleum, Petrochemicals, and Advanced Materials.
Forum Vol. 480-481 (2005), p. 549
Effect of Input Power on the Deposition of Optical Grade Thick Diamond Film in a DCPJ CVD Jet System
Online since: January 2010
Authors: Dun Wen Zuo, Rong Fa Chen, Zhao Xia Shen, Liang Gang Dai, Xian Liang Zhang, Rui Zhu
Zuo
2
1 Department of Mechanical Engineering, Yangzhou University, Yangzhou, 225009, China
2 Department of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and
Astronautics, Nanjing, 210016, China
arrchen@tom.com
Keywords: input power, thick diamond film, CVD, thick diamond film
Abstract.
Song et al: Key Engineering Material Vol. 258-259 (2004), p. 517 [2] G.H.
Li, et al: Advanced Materials Research Vols. 24-25(2007),p.377-382 [7] R.F.
Li, et al: Key Engineering Materials, Vols. 359-360(2008), p.285-289 [8] R.F.
Li, et al: Materials Science Forum Vols. 532-533(2006), p.464-467 [9] T.
Song et al: Key Engineering Material Vol. 258-259 (2004), p. 517 [2] G.H.
Li, et al: Advanced Materials Research Vols. 24-25(2007),p.377-382 [7] R.F.
Li, et al: Key Engineering Materials, Vols. 359-360(2008), p.285-289 [8] R.F.
Li, et al: Materials Science Forum Vols. 532-533(2006), p.464-467 [9] T.
Online since: January 2015
Authors: Liang Hao, Hiroyuki Yoshida, Kou Matsuzaka, Yun Lu, Jin Xiang Chen, Su Jun Guan
Preparation and Photocatalytic Activity of TiO2–Copper Oxides Composite Coatings by Mechanical Coating Technique and Heat Oxidation
Yun Lu1, a, Liang Hao2,b, Kou Matsuzaka3, Hiroyuki Yoshida4, Sujun Guan3
and Jinxiang Chen5
1 Graduate School & Faculty of Engineering, Chiba University,
1-33, Yayoi-cho, Inage-ku, Chiba, 263-8522, Japan
2 College of Mechanical Engineering, Tianjin University of Science and Technology
No.1038, Dagu Nanlu, Hexi District, Tianjin 300222, P.R.
China 3 Graduate School & Faculty of Engineering, Chiba University 4 Chiba Inductrial Technology Research Institute, 889, Kasori-cho, Wakaba-ku, Chiba, 264-0017, Japan 5 International Institute for Urban Systems Engineering, Southeast University, Nanjing 210096, China a luyun@faculty.chiba-u.jp, b haoliang@tust.edu.cn Keywords: mechanical coating technique, heat oxidation, TiO2, copper oxide, composite coatings, photocatalytic activity.
As a new film- and coating-preparation method, mechanical coating technique (MCT) has been used to prepare a variety of advanced materials, including metal coatings [2–4], alloy coatings [5], solid-solution coatings [6], and photocatalytic films [7–9].
Forum 675–677 (2011) 1233–1236
China 3 Graduate School & Faculty of Engineering, Chiba University 4 Chiba Inductrial Technology Research Institute, 889, Kasori-cho, Wakaba-ku, Chiba, 264-0017, Japan 5 International Institute for Urban Systems Engineering, Southeast University, Nanjing 210096, China a luyun@faculty.chiba-u.jp, b haoliang@tust.edu.cn Keywords: mechanical coating technique, heat oxidation, TiO2, copper oxide, composite coatings, photocatalytic activity.
As a new film- and coating-preparation method, mechanical coating technique (MCT) has been used to prepare a variety of advanced materials, including metal coatings [2–4], alloy coatings [5], solid-solution coatings [6], and photocatalytic films [7–9].
Forum 675–677 (2011) 1233–1236
Online since: March 2017
Authors: Peter Horňak, Peter Zimovčák, Svätoboj Longauer, Pavol Zahumenský, Martin Šebek
Sankaran, Materials Science and Engineering A 568 (2013) 171-175
Yuan, Advanced Materials Research 476-478 (2012) 241-247
Palkowski, Materials Science and Engineering A 538 (2012) 42-52
Tang, Advanced Materials Research 146-147 (2011) 1331-1335
Zhao, Advanced Materials Research 299-300 (2011) 359-363
Yuan, Advanced Materials Research 476-478 (2012) 241-247
Palkowski, Materials Science and Engineering A 538 (2012) 42-52
Tang, Advanced Materials Research 146-147 (2011) 1331-1335
Zhao, Advanced Materials Research 299-300 (2011) 359-363
Online since: April 2009
Authors: José Lemus-Ruiz, Osvaldo Flores, Ana L. Salas-Villaseñor
Thus, joining ceramics to metals is a key
technology in the use of advanced ceramics in complex structures [7,8].
Moreover, the use of advanced ceramics depends on the reliability of ceramic-metal joining processes and the properties of the resulting interfaces.
Modern ceramic engineering. 2nd edn.
Materials Science Forum vol. 509 (2006), p. 99-104
Joining of advanced ceramics in green state.
Moreover, the use of advanced ceramics depends on the reliability of ceramic-metal joining processes and the properties of the resulting interfaces.
Modern ceramic engineering. 2nd edn.
Materials Science Forum vol. 509 (2006), p. 99-104
Joining of advanced ceramics in green state.
Online since: August 2018
Authors: Mohd Amri Lajis, Shazarel Shamsudin, Nur Kamilah Yusuf, Azlan Ahmad
Integrating Simulation with Experiment for Recycled Metal Matrix Composite (MMC-AlR) Developed through Hot Press Forging
Azlan Ahmad1,a*, Mohd Amri Lajis2,b*, Shazarel Shamsudin2,c
and Nur Kamilah Yusuf2,d
1Department of Mechanical Engineering, Universiti Teknologi PETRONAS, 32610 Seri Iskandar, Perak Darul Ridzuan, Malaysia
2Sustainable Manufacturing and Recycling Technology, Advanced Manufacturing and Materials Center (SMART-AMMC), Universiti Tun Hussein Onn Malaysia, 86400 Parit Raja,
Batu Pahat, Johor, Malaysia
aazlan.ahmad@utp.edu.my, bamri@uthm.edu.my, cshazarel@uthm.edu.my, dnurkamilah@uthm.edu.my
Keywords: Sustainable manufacturing, Direct metal recycling, Hot press forging, Aluminium recycling, Metal matrix composite, Reinforced particles.
MMCs have been a subject of scientific investigation and applied research for about two decades but only in the past few years, these advanced materials became realistic candidates in engineering components [7].
The authors would also like to express their special thanks to Sustainable Manufacturing and Recycling Technology, Advanced Manufacturing and Materials Centre (SMART-AMMC), Universiti Tun Hussein Onn Malaysia (UTHM) and Universiti Teknologi PETRONAS for their support.
He, “Thermal characteristics analysis of hardened steel die transition region in machining process,” in Materials Science Forum, 2016, vol. 836, pp. 394–401
MMCs have been a subject of scientific investigation and applied research for about two decades but only in the past few years, these advanced materials became realistic candidates in engineering components [7].
The authors would also like to express their special thanks to Sustainable Manufacturing and Recycling Technology, Advanced Manufacturing and Materials Centre (SMART-AMMC), Universiti Tun Hussein Onn Malaysia (UTHM) and Universiti Teknologi PETRONAS for their support.
He, “Thermal characteristics analysis of hardened steel die transition region in machining process,” in Materials Science Forum, 2016, vol. 836, pp. 394–401
Online since: May 2021
Authors: V.A. Kalneus, V.V. Larichkin, A.A. Briutov, D.A. Nemushchenko
Research of Physical and Mechanical Properties of Fly Ash Ceramics
with SiO2 and Al2O3 Nanoparticles as Functional Addition
Kalneus V.A.1,2,a, Nеmushchеnko D.A.1,b, Larichkin V.V.1,c, Briutov A.A.2,d
1Department of Engineering Issues in Ecology, Novosibirsk State Technical University,
20 Prospekt K.
At the Department of Engineering Issues in Ecology at the Novosibirsk State Technical University, research is being conducted on the creation of solid waste utilization technologies to obtain materials for various purposes (mostly construction materials).
Jovanov, Production of ceramics from coal fly ash, Chemical Industry and Chemical Engineering Quarterly. 18(2) (2012) 245-254
Rijab, Mechanical properties of epoxy nanocomposite, International Journal of Advanced Research. 3(6) (2015) 1468-1472
Mechanical engineering, materials science. 1 (2011) 117-120.
At the Department of Engineering Issues in Ecology at the Novosibirsk State Technical University, research is being conducted on the creation of solid waste utilization technologies to obtain materials for various purposes (mostly construction materials).
Jovanov, Production of ceramics from coal fly ash, Chemical Industry and Chemical Engineering Quarterly. 18(2) (2012) 245-254
Rijab, Mechanical properties of epoxy nanocomposite, International Journal of Advanced Research. 3(6) (2015) 1468-1472
Mechanical engineering, materials science. 1 (2011) 117-120.