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Online since: August 2016
Authors: Carlos Maurício Fontes Vieira, Jonas Alexandre, Afonso Rangel Garcez de Azevedo, Gustavo de Castro Xavier, Sergio Neves Monteiro, Fabio de Oliveira Braga, Carla Bozzi Piazzarollo
Alberto Lamego, 2000, 28013-602, Campos dos Goytacazes, Brazil.
2 UENF - State University of the Northern Rio de Janeiro, LAMAV – Laboratory of Advanced Materials; Av.
Alberto Lamego, 2000, 28013-602, Campos dos Goytacazes, Brazil. 3IME - Military Institute of Engineering, Department of Materials Science, Praça General Tibúrcio, 80, 22290-270, Rio de Janeiro, Brazil.
All tests an experiment were carried out at the Laboratory of Civil Engineering, LECIV, in the Center of Science and Technology, CCT, of the state University of the Northern Rio de Janeiro, UENF, in Campos dos dos Goytacazes.
Forum Vols. 775-776 (2014), p. 69
Rethwisch: Material Science and Engineering: An Introduction.
Alberto Lamego, 2000, 28013-602, Campos dos Goytacazes, Brazil. 3IME - Military Institute of Engineering, Department of Materials Science, Praça General Tibúrcio, 80, 22290-270, Rio de Janeiro, Brazil.
All tests an experiment were carried out at the Laboratory of Civil Engineering, LECIV, in the Center of Science and Technology, CCT, of the state University of the Northern Rio de Janeiro, UENF, in Campos dos dos Goytacazes.
Forum Vols. 775-776 (2014), p. 69
Rethwisch: Material Science and Engineering: An Introduction.
Online since: October 2006
Authors: Shin Ichi Nishizawa, Michel Pons
From the engineering point of view, SiC hot-wall epitaxy is a very important process in
SiC semiconductor processes.
The requirements for the epitaxial process strongly depend on the devices, so there are many investigations from fundamental to engineering levels.
Design of Engineering Epitaxial Reactor.
From the engineering points of view, it is necessary to keep good uniformity of both epitaxial layer thickness and doping concentration, inside a wafer and between wafers.
In the experiment, there are lots of investigations that try to understand the fundamental processes and also try to develop engineering reactors.
The requirements for the epitaxial process strongly depend on the devices, so there are many investigations from fundamental to engineering levels.
Design of Engineering Epitaxial Reactor.
From the engineering points of view, it is necessary to keep good uniformity of both epitaxial layer thickness and doping concentration, inside a wafer and between wafers.
In the experiment, there are lots of investigations that try to understand the fundamental processes and also try to develop engineering reactors.
Online since: February 2014
Preface
The 2013 International Forum on Computer and Information Technology (IFCIT 2013)
was held in Shenzhen, China, 24-25 December 2013.
The IFCIT2013 brought together scientists and researchers from 12 countries, affiliated with universities, technology centers and industrial firms to debate topics related to advanced technologies for computer application and information technology application, which would enhance the sustainable development of this field.
The technical papers included in this volume on the following topics: Databases, Data Processing and Data Management, Parallel and Distributed Computing, Computer Network Technology and Applications, Software Engineering, E-Commerce and E-Government, Multimedia Technology and Application, Computer Vision and Image Processing Technology, Artificial Intelligence, Intelligent Algorithms and Computational Mathematics, Computer Aided Design and Research, Communications Technology and Signal Processing, Electronic Devices and Embedded Systems, Intelligent Instruments, Techniques for Detection and Testing, Sensors and Measurement, Automation and Control, Information Technologies in Engineering Management, Enterprise Resource Planning and Management System, Information Technologies in Education, etc.
We sincerely hope that the 2013 International Forum on Computer and Information Technology is a significant step forward.
(ID: 212.3.110.94-03/03/14,10:09:30)2013 International Forum on Computer and Information Technology (IFCIT 2013) Conference Organization Co-Chairmen Prof.
The IFCIT2013 brought together scientists and researchers from 12 countries, affiliated with universities, technology centers and industrial firms to debate topics related to advanced technologies for computer application and information technology application, which would enhance the sustainable development of this field.
The technical papers included in this volume on the following topics: Databases, Data Processing and Data Management, Parallel and Distributed Computing, Computer Network Technology and Applications, Software Engineering, E-Commerce and E-Government, Multimedia Technology and Application, Computer Vision and Image Processing Technology, Artificial Intelligence, Intelligent Algorithms and Computational Mathematics, Computer Aided Design and Research, Communications Technology and Signal Processing, Electronic Devices and Embedded Systems, Intelligent Instruments, Techniques for Detection and Testing, Sensors and Measurement, Automation and Control, Information Technologies in Engineering Management, Enterprise Resource Planning and Management System, Information Technologies in Education, etc.
We sincerely hope that the 2013 International Forum on Computer and Information Technology is a significant step forward.
(ID: 212.3.110.94-03/03/14,10:09:30)2013 International Forum on Computer and Information Technology (IFCIT 2013) Conference Organization Co-Chairmen Prof.
Online since: January 2013
Authors: Sergey P. Lebedev, Alla A. Sitnikova, Marina G. Mynbaeva, Demid A. Kirilenko, Irina S. Kotousova, Alexander Smirnov, Alexander A. Lavrent'ev, Vassili N. Petrov
The feasibility of porous SiC for bio–engineering has been shown in pioneering works by A.J.
Saddow, Silicon carbide biotechnology: biocompatible semiconductor for advanced biomedical devices and applications, Elsevier, Amsterdam, 2012
Gorga, Nanofibrous composites for tissue engineering applications, WIREs Nanomed.
Forum 527–529 (2006) 751–754
Forum 483–485 (2004) 269–272
Saddow, Silicon carbide biotechnology: biocompatible semiconductor for advanced biomedical devices and applications, Elsevier, Amsterdam, 2012
Gorga, Nanofibrous composites for tissue engineering applications, WIREs Nanomed.
Forum 527–529 (2006) 751–754
Forum 483–485 (2004) 269–272
Online since: July 2011
Authors: L. Zhang, Yun Huang, M. Zhang
And, belt grinding can process almost all the engineering materials, so it was as the new process, which called as the "universal grinding" and "cold grinding" in the advanced manufacturing technology, it was as important as the grinding wheel and indispensable processing methods[5,6].
Shen, etal: Journal of Mechanical Engineering, Forum Vol. 45(2009), pp: 101-105
Sun, etal: Chinese Journal of Mechanical Engineering, Forum Vol. 38 (2002), pp: 68-73
Luo, etal: Chinese Journal of Mechanical Engineering, Forum Vol. 39 (2003), pp: 98-101
Huang: Chinese Journal of Mechanical Engineering, Forum Vol. 18(2003), pp: 2263-2267.
Shen, etal: Journal of Mechanical Engineering, Forum Vol. 45(2009), pp: 101-105
Sun, etal: Chinese Journal of Mechanical Engineering, Forum Vol. 38 (2002), pp: 68-73
Luo, etal: Chinese Journal of Mechanical Engineering, Forum Vol. 39 (2003), pp: 98-101
Huang: Chinese Journal of Mechanical Engineering, Forum Vol. 18(2003), pp: 2263-2267.
Online since: January 2022
Authors: Xiong Zhang, Zi Li Wu, Xiang Hua Zeng, Qian Dai
Enhanced Performance of the Non-Polar Ultraviolet Light-Emitting Diodes with Lattice-Matched Quaternary Quantum Barriers
Qian Dai1,a,*, Xiong Zhang2,b, Zili Wu2,c and Xianghua Zeng3,d
1School of Network and Communication Engineering, Jinling Institute of Technology, Nanjing, Jiangsu, China
2Advanced Photonics Center, School of Electronic Science and Engineering, Southeast University, Nanjing, Jiangsu, China
3College of Physics Science and Technology, Yangzhou University, Yangzhou, Jiangsu, China
adaiqian@jit.edu.cn, bxzhang62@aliyun.com, c230189117@seu.edu.cn, dxhzeng@yzu.edu.cn
Keywords: non-polar AlGaN-based UV-LED, AlInGaN quaternary barriers, lattice match, internal quantum efficiency
Abstract.
In this paper, the electrical and optical characteristics of a non-polar a-plane AlGaN-based UV-LED with lattice matched quantum barriers along the [1-100] direction were intensively analyzed with the advanced physical model of semiconductor devices (APSYS) simulation program.
Forum Vol. 68 (1996) p. 40 [20] Y.
Forum Vol. 158 (2011) p.
Forum Vol. 117 (2020) p. 012105.
In this paper, the electrical and optical characteristics of a non-polar a-plane AlGaN-based UV-LED with lattice matched quantum barriers along the [1-100] direction were intensively analyzed with the advanced physical model of semiconductor devices (APSYS) simulation program.
Forum Vol. 68 (1996) p. 40 [20] Y.
Forum Vol. 158 (2011) p.
Forum Vol. 117 (2020) p. 012105.
Online since: August 2013
Authors: Xiao Cong He
Numerical Studies on Friction Stir Welding of Lightweight Materials
Xiaocong He
Innovative Manufacturing Research Centre,Faculty of Mechanical and Electrical Engineering, Kunming University of Science and Technology, Kunming,650500, P.
Friction stir welding (FSW) is a relatively new solid-state fastening method which is suitable for joining advanced lightweight metal sheets that are hard to weld.
An advanced FE model was presented by Hamilton et al. [16] for simulating FSW process.
Simoncini: Mater Sci Forum, Vols 638-642, (2010), p 3954 [25] Z.
Gao: Mater Sci Forum, Vols 620-622, (2009), p 233 [28] J.G.
Friction stir welding (FSW) is a relatively new solid-state fastening method which is suitable for joining advanced lightweight metal sheets that are hard to weld.
An advanced FE model was presented by Hamilton et al. [16] for simulating FSW process.
Simoncini: Mater Sci Forum, Vols 638-642, (2010), p 3954 [25] Z.
Gao: Mater Sci Forum, Vols 620-622, (2009), p 233 [28] J.G.