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The reduction of chipping during dicing, which is the ultra-precision sawing process of silicon wafer in the die form, is becoming more and more important, since the smallest chipping can cause damage to the circuit [3].
It shows the important of dicing process of silicon wafer as waveguide transfer mechanism for the data transfer in electronic device and other functionality.

Introduction Since the past decades, incremental sheet metal forming has been investigated with a great attention due to its potential for the rapid prototyping of sheet metal parts in terms of flexibility, formability and cost reduction compared to conventional processes.
In this study, MINITAB 14 was used to statistically analyze the data [10].

Unfortunately, it is difficult to binarize WEM directly through applying most existing binarization algorithms which require the input data being the form of image.
One available solution is transforming WEM into the image form, which means the high dimensional equalization vector needs to be compressed into the one-dimensional form by an effective dimensionality-reduction method.

A serious, reliable assessment of FCG and residual life of a component can only be carried out on the basis of a sufficient set of experimental material data from both stable crack growth and threshold regions, whereas scatter has to be considered, too.
Load shedding method was used for pre-cracking, i.e. stepwise reduction of load range according to standard recommendations.

Under low pH condition, higher gold mineralization was obtained, although there was a significant reduction in the number of viable cell (data not shown).

This reduction is possibly due to the higher solubility of etch residues in the co-solvent.
The etch rate data are plotted on semilogarithmic coodinates as a function of reciprocal absolute temperature.

The use of light weight aggregate concrete generally results in an overall saving of 10–20% of the total cost of the equivalent normal weight concrete and also the reduction in density allows smaller structural members [10].
Using a straight line between shear capacities of FE of LWAC versus Canadian code can be fitted through the data with reasonable accuracy and the slope of this line is about 0.67.

Image-based FEA allows one to generate FEA models directly from CT or MRI data [6].
Artifacts or cracks that occurred within the scaffold (can be seen from harvested scaffold CT images after the implantation) cause the reduction of the moduli both computationally and experimentally as represented in scaffold number 2 (SC2) of 4 weeks time point as well as scaffold number 3 (SC3) of eight weeks time point.

This study presents preliminary data regarding the development of an approach consisting of local heating of aluminium alloy structures with the purpose of introducing a local modification of material properties.
With different combinations of parameters it was possible to obtain a significant reduction of hardness in the specimen (furnace tests) or in localized areas (laser processing).

All these problems lead to the reduction of the machining accuracy.
Control Algorithm of the Normal Tracing In digital control system, the computer provides the position command of the coordinate axis to servo system in real-time machining by computing the data of the work piece memorized in memory.