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Acknowledgement The authors would like to thank the Department of Electrical, Computer and Telecommunications Engineering (ECT) under the Faculty of Engineering in Botswana International University of Science and Technology (BIUST) for the financial support.References [1] M.
Hameed, "A gaas based metal-interlayer- semiconductor s/d finfet," in 2018 International Conference on Emerging Trends and Innovations In Engineering And Technological Research (ICETIETR), pp. 1-4, 2018
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The overlapping was always on the advancing side.
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Adesta1,b, Muhammad Riza1,c 1Manufacturing and Material Engineering Department, Faculty of Engineering, IIUM, P.O.
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Hemanth Vepakomma, Three Dimensional Thermal Modeling Of Friction Stir Processing, Master Thesis, The Florida State University College Of Engineering, 2006 [8] Y.J.
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Ahmad Hambali2,d 1CoE Frontier Materials Research, School of Material Engineering, Universiti Malaysia Perlis, 01000 Kangar, Perlis, Malaysia 2School of Microelectronic Engineering, Universiti Malaysia Perlis, 02600 Arau, Perlis, Malaysia 3School of Material Engineering, Universiti Malaysia Perlis, 02600 Arau, Perlis, Malaysia aCorresponding author: fatinadilaismail@gmail.com, brozana@unimap.edu.my, csobri@unimap.edu.my, dazura@unimap.edu.my Keywords: Solid State Reaction, Electrical Properties, Microstructure, Rietveld refinement analysis Abstract.
INTRODUCTION The miniaturization of electronic devices especially the storage devices becomes important for the sake of advanced microelectronic and communication.
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The company offers advanced solutions and tools for developing 3D models and their creation.
Prototypes for project evaluation and performance products by function are divided into three types: sketch, cosmetic and engineering.
Engineering prototypes are used to assess the functional suitability of the new development.
IOP Conference Series: Materials Science and Engineering. 1 (2014) 1-4
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Introduction In modern automobile industry, new types of advanced high-strength steels (AHSSs) are developed in order to lighten the body weight.
The engineering stress vs. engineering strain curve of four RVE models are shown in Fig. 4, where a sudden decreasing of stress level can be noticed at a strain range from 0.008 to 0.01.
Fig. 4 Engineering stress vs. engineering strain curve of four models Fig. 5 Formation of initial crack in model A: (a) Local microstructure (b) Equivalent plastic strain (PEEQ) (c) Stress triaxiality (TRIAX) Fig. 6 Formation of initial crack of different models: (a) Model B (c) Model C (c) Model D Crack Propagation.
Bleck, Failure modeling of multiphase steels using representative volume elements based on real microstructures, Procedia Engineering 1 (2009) 171-176
Gutierrez, Unified formulation to predict the tensile curve of steels with different microstructures, Materials Science Forum, 2003, 4525-4530

Acknowledgements This work was financially supported by the National Natural Science Foundation of China (51065006) and Guangxi Key Laboratory of manufacturing System & Advanced Manufacturing Technology (09-007-05S007 & 0842006_039_K).
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Researchers thank the Department of Mining and Materials Engineering, Faculty of Engineering, Prince of Songkla University in Thailand.
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Introduction In the last two decays, Zinc-Aluminum (Zn-Al) alloys in general and Zinc-Aluminum 5 (ZA5) alloy, in particular, have been widely used in industrial and engineering applications.
Histogram of Fatigue Data for ZA5 and its micro-alloys References [1] Budinski, K.G. (1992), "Engineering Materials Properties and Selection", 4th Edition, Prentice-Hall, Inc., New Jersey
[9] Zaid, A.I.O, (2006), "Grain Refinement of Zn-Al Alloys", Proc. of the 2nd International Conference on the Frontiers of Engineering Materials, FAEM-2006, Lahore, Pakistan
[12] Zaid, A.I.O and Al-Banna, M.A., (2002), PEDD-6, Proc. of the Sixth International Conference on Production Engineering Design and Development, Cairo, Egypt (2002)
[13] Zaid A.I.O and Al-Qawabha, (September 2003), “Effect of Ti and Ti+B on the Mechanical Strength and Fatigue Life of Zinc Aluminum Alloy -5 (ZA-5)”, Proceeding of the International Symposium on Advanced Material, ISAM-2003