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[3] Haoquan Yang, Ping Zhou.
Electronic Industry Press, 2009 [7] Naiyang Deng, Yingjie Tian.

Tian, X.
Yang, Numerical simulation of mold filling in injection molding using a three-dimensional finite volume approach, Int.

Yang, L.
Tian, D.

Yang and G.N.
Tian: Computer Integrated Manufacturing Systems, Vol. 13 (2007) No.4, pp.727-737.

Research on intelligent diagnosis system with machine learning[J].Computer Engineering and Application,2008,44(22) ,31-34(in Chinese) [2] hui Shi,wei Wang,yi Gao.General fault diagnosis expert system development platform[J].Computer Measurement& Control, 2005,13(11) ,1167-1168(in Chinese) [3] Luka J,Stubhan F.Mobile diagnosis[J].In:IEEE International Vehicle Electronic Conference, Changchun,China,1999, 215-220 [4] Achmad Widodo,Bo-Suk Yang,Tian Han.

[7] Q W Wang, G Y Tian, Z Y Yang.

Tian: Study on Grinding-based Flattening Theory and Process Technology for Large-sized Silicon Wafer (Ph.D., Dalian University of Technology, China 2007) p.33 [5] H.K.
Yang: Journal of the Electrochemical Society, Vol. 131(1984), p. 1140

[7] Haijiang Du, Minghao Yang, Lili Chou and Zejun Zhang.
[8] Junmei Tian, Wenhua Fu, Mingkai Liu and Tailin Xue: 3rd International Conference on Power Electronics and Intelligent Transportation system (Shenzhen, China, November 13-14, 2010). vol.6, p.365

Yang.
Tian, W.

[2] Tang Xiao-ming, Yang Jia-lin, Jiang Xu-guang, Chi Yong, Yan Jian-hua.
A study of white mud in flue gas desulfurization in power plants, China Pulp and Paper Industry, Vol. 34 (2008) 23-26 [6] CHU Xianfeng，DING Fujun，TIAN Jianru.